Solving 5G And 6G Challenges With Artificial Intelligence

By Sarah LaSelva - 27 Jul, 2023 - Comments: 0

Wireless networks are inherently complex, generate massive amounts of data, and have grown in complexity with each new generation of technology. This combination of large data sets and complexity makes wireless networks an ideal candidate for AI. People are receiving first-hand experiences of the power and potential of deep neural networks and machine learning (ML) as the technology begins t... » read more

Using AI To Close Coverage Gaps

By Ed Sperling - 26 Jul, 2023 - Comments: 0

Verification of complex, heterogeneous chips is becoming much more difficult and time-consuming. There are more corner cases, and devices have to last longer and behave according to spec throughout their lifetimes. This is where AI fits in. It can help identify redundancy and provide information about why a particular device or block may not be able to be fully covered, and it can do it in less... » read more

Generative AI Training With HBM3 Memory

By Frank Ferro - 20 Jul, 2023 - Comments: 0

One of the biggest, most talked about application drivers of hardware requirements today is the rise of Large Language Models (LLMs) and the generative AI which they make possible. The most well-known example of generative AI right now is, of course, ChatGPT. ChatGPT’s large language model for GPT-3 utilizes 175 billion parameters. Fourth generation GPT-4 will reportedly boost the number of... » read more

A Bridge From Mars To Venus

By Steve Roddy - 20 Jul, 2023 - Comments: 0

In a now-famous 1992 pop psychology book titled "Men Are from Mars, Women Are from Venus," author John Gray posited that most relationship troubles in couples stem from fundamental differences in socialization patterns between men and women. The analogy that the two partners came from different planets was used to describe how two people could perceive issues in completely different and sometim... » read more

Megatrends At DAC

By Ann Mutschler - 17 Jul, 2023 - Comments: 0

Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella... » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances

By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

A Photonic Circuit Architecture Allowing Faster, More Efficient Transfer of Large Amounts of Data

By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "Massively scalable Kerr comb-driven silicon photonic link" was published by researchers at Columbia University and Air Force Research Laboratory. Abstract: "The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limi... » read more

Solving The Last-Mile Delivery Problem

By John Koon - 06 Jul, 2023 - Comments: 0

Retailers are deploying robots to cut costs and improve efficiency, opening new opportunities for chipmakers as well as a host of new challenges. Key to this strategy are autonomous roadside delivery robots (ARDRs). Retailers have been facing razor-thin profit margins for years and have turned their sights to increasing operational efficiency to stay competitive. Solving the last-mile delive... » read more

Changes In Memory Design

By Ed Sperling - 29 Jun, 2023 - Comments: 0

An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Balancing AI And Engineering Expertise In The Fab

By Laura Peters - 28 Jun, 2023 - Comments: 1

Modeling and simulation are playing increasingly critical roles in chip development due to tighter process specs, shrinking process windows, and fierce competition to bring technologies to market first. Before a new device makes it to high-volume manufacturing, there are countless engineering hours spent on developing the lithography, etching, deposition, CMP, and many other processes, at hi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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