The Coming NPU Population Collapse


At some point in everyone’s teenage years of schooling we were all taught in a nature or biology class about cycles of population surges and then inevitable population collapses. Whether the example was an animal, plant, insect or even bacteria, some external event triggers a rapid surge in the population of a species which leads to overpopulation and competition for resources (food, space, s... » read more

The Best DRAMs For Artificial Intelligence


Artificial intelligence (AI) involves intense computing and tons of data. The computing may be performed by CPUs, GPUs, or dedicated accelerators, and while the data travels through DRAM on its way to the processor, the best DRAM type for this purpose depends on the type of system that is performing the training or inference. The memory challenge facing engineering teams today is how to keep... » read more

The Data Dilemma In Semiconductor Testing And Why It Matters: Part 1


In today’s semiconductor industry, machine learning (ML) is no longer a buzzword — it’s an operational necessity. From optimizing test flows to identifying device drifts and executing advanced analytics like VMIN or trimming, ML-based applications are increasingly used to boost yields, improve quality, and lower test costs. But there’s a catch. To make these intelligent applications ... » read more

Multimodal AI For IoT Devices Requires A New Class Of MCU


The rise of AI-driven IoT devices is pushing the limits of today’s microcontroller unit (MCU) landscape. While AI-powered perception applications—such as voice, facial recognition, object detection, and gesture control—are becoming essential in everything from smart home devices to industrial automation, the hardware available to support them is not keeping pace. The challenge? The broad ... » read more

Boosting AI Performance With CXL


As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous iterations for data comparison, predictive calculations, and parameter results updating during training. Hence, there is a constant demand for flexible memory expansion and memory sharing among d... » read more

Executive Outlook: Chiplets, 3D-ICs, and AI


Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product ... » read more

Optical Interconnectivity At 224 Gbps


AI is generating so much traffic that traditional copper-based approaches for moving data inside a chip, between chips, and between systems, are running out of steam. Just adding more channels is no longer viable. It requires more power to drive signals, and the distance those signals can travel without excessive loss is shrinking. Mike Klempa, product marketing specialist at Alphawave Semi, di... » read more

Inside Chips Podcast: May 27


Jo De Boeck, chief strategy officer and EVP at imec, talks with Semiconductor Engineering Technology Editor Gregory Haley about system technology co-optimization and the intersection of technology and AI. https://www.youtube.com/watch?v=XUgQPBIaDHQ » read more

Energy-Efficient Computing Systems For Sustainable AI


As artificial intelligence (AI) proliferates rapidly, AI models and datasets are also growing rapidly in size. This growth far outpaces performance improvement in hardware systems, and is increasing AI’s energy consumption unsustainably. To address these challenges and explore collaborative solutions, SEMI’s Smart Data-AI Initiative – as part of its Future of Computing focus – r... » read more

Future-proofing AI Models


Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to discuss the challenges of future-proofing these designs with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vic... » read more

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