Configuring AI Chips


Change is almost constant in AI systems. Vinay Mehta, technical product marketing manager at Flex Logix, talks about the need for flexible architectures to deal with continual modifications in algorithms, more complex convolutions, and unforeseen system interactions, as well as the ability to apply all of this over longer chip lifetimes. Related Dynamically Reconfiguring Logic A differ... » read more

Automotive AI Hardware: A New Breed


Arteris IP functional safety manager Stefano Lorenzini recently presented “Automotive Systems-on-Chip (SoCs) with AI/ML and Functional Safety” at the Linley Processor Conference. A main point of the presentation was that conventional wisdom on AI hardware markets is binary. There’s AI in the cloud: Big, power-hungry, general-purpose. And there’s AI at the edge: Small, low power, limited... » read more

The Case For FPGAs In Cars


Field-programmable gate arrays (FPGAs) thrive in rapidly evolving new markets before being replaced by hard-wired ASICs, but in automotive that crossover is likely to happen significantly later than in the past. Historically, FPGAs have held temporary positions until volumes increased enough to cost-reduce the FPGAs out in favor of a hardened version. With automobiles, there are so many chan... » read more

Security Solutions for AI/ML


AI/ML is increasingly pervasive across all industries driven by a massive wave of digitization. Data, the raw material of AI/ML and Deep Learning algorithms, is available in enormous quantities from all aspects of business operations. AI/ML promises great gains in responsiveness and adaptability in an ever-changing technology landscape, and industries are enthusiastically responding to that app... » read more

AI Testing: Pushing Beyond DFT Architectures


Every day, more applications are deploying artificial intelligence (AI) system to increase automation beyond traditional systems. The continuous growth in computing demands of AI systems require designers to develop massive, highly parallel AI processor chips. Their large sizes and types of applications have a significant impact on their design and test methodologies. With thousands of repeated... » read more

Pushing The Limits Of Hardware-Assisted Verification


As semiconductor complexity continues to escalate, so does the reliance on hardware-assisted simulation, emulation, and prototyping. Since chip design first began, engineers have complained their design goals exceeded the capabilities of the tools. This is especially evident in verification and debug, which continue to dominate the design cycle. Big-iron tooling has enabled design teams to k... » read more

Scaling Simulation


Without functional simulation the semiconductor industry would not be where it is today, but some people in the industry contend it hasn't received the attention and research it deserves, causing a stagnation in performance. Others disagree, noting that design sizes have increased by orders of magnitude while design times have shrunk, pointing to simulation remaining a suitable tool for the job... » read more

One-On-One: Lip-Bu Tan


Lip-Bu Tan, CEO of Cadence, sat down with Semiconductor Engineering to talk about the impact of massive increases in data across a variety of industries, the growing need for computational software, and the potential implications of U.S.-China relations. What follows are excerpts of that discussion. SE: What do you see as the biggest change for the chip industry? Tan: We're in our fifth g... » read more

The Increasingly Uneven Race To 3nm/2nm


Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Demand, Lead Times Soar For 300mm Equipment


A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

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