tag: AI

Security Risks In The Supply Chain
By Ed Sperling - 09 Jan, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss security in the supply chain with Warren Savage, research scientist in the Applied Research Laboratory for Intelligence and Security at the University of Maryland; Neeraj Paliwal, vice president and general manager of Rambus Security; Luis Ancajas, marketing director for IoT security software solutions at Micron; Doug Suerich, product evangelist at ... » read more

CEO Outlook: 2020 Vision
By Ed Sperling - 06 Jan, 2020 - Comments: 0

The start of 2020 is looking very different than the start of 2019. Markets that looked hazy at the start of 2019, such as 5G, are suddenly very much in focus. The glut of memory chips that dragged down the overall chip industry in 2019 has subsided. And a finely tuned supply chain that took decades to develop is splintering. A survey of CEOs from across the industry points to several common... » read more

Improving Algorithms With High-Level Synthesis
By Ann Mutschler - 30 Dec, 2019 - Comments: 0

Most computer algorithms today are developed in high-level languages on general-purpose computers. But someday they may be deployed in embedded systems where the development, verification, and validation of algorithms is done in languages like python, Java, C++, or even numerical frameworks like MatLab. This is the goal of high-level synthesis (HLS), and it aims to solve a fundamental proble... » read more

What Engineers Are Reading And Watching
By Brian Bailey - 26 Dec, 2019 - Comments: 0

By Brian Bailey And Ed Sperling An important indicator of where the chip industry is heading is what engineers are reading and what videos they are watching. While some subjects remain on top, such as the level of interest in the latest manufacturing technologies, other areas come and go. The stories with the biggest traffic numbers are almost identical to last year. Readers want to know wh... » read more

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

What Will AI Look Like In 10 Years?
By Ed Sperling - 19 Dec, 2019 - Comments: 0

There's no such thing as reverse in AI systems. Once they are let loose, they do what they were programmed to do — optimize results within a given set of parameters. But today there is no consistency for those parameters. There are no standards by which to measure how AI deviates over time. And there is an expectation, at least today, that AI systems will adapt to whatever patterns they di... » read more

AI Chips Driving Need For New Test Implementation Methodologies
By David Buck - 19 Dec, 2019 - Comments: 0

Artificial intelligence has never been more in the news than it is today.  From picking stock market investments to autonomous driving, we have heard about what AI can do when it works and what happens when it goes awry. The consequences are huge if AI doesn’t work which puts a lot of pressure on hardware engineers to ensure that their chips can be extensively tested for proper and safe func... » read more

What Worked, What Didn’t In 2019
By Brian Bailey - 19 Dec, 2019 - Comments: 1

2019 has been a tough year for semiconductor companies from a revenue standpoint, especially for memory companies. On the other hand, the EDA industry has seen another robust growth year. A significant portion of this disparity can be attributed to the number of emerging technology areas for semiconductors, none of which has reached volume production yet. Some markets continue to struggle, a... » read more

Scaling, Packaging, And Partitioning
By Ed Sperling - 17 Dec, 2019 - Comments: 0

Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

Co-Design For The AI Era
By Buvna Ayyagari-Sangamalli - 17 Dec, 2019 - Comments: 0

Welcome to the second piece in our blog series examining how the computing industry can work in new ways to enable the AI Era. In our first blog, my colleague Ellie Yieh described the enormous opportunities and challenges facing the industry as we enter a new decade, and she offered a path for accelerating innovation—from materials to systems—based on a “New Playbook” for driving im... » read more

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