Week In Review: Design, Low Power


eSilicon debuted its 7nm high-bandwidth interconnect (HBI)+ PHY IP, a special-purpose hard IP block that offers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications such as chiplets. HBI+ PHY delivers a data rate of up to 4.0Gbps per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 2... » read more

Week In Review: Design, Low Power


M&A ANSYS will acquire Livermore Software Technology Corp. (LSTC), a provider of explicit dynamics and other advanced finite element analysis technology. Based in Livermore, CA, LSTC was founded in 1987 to commercialize the DYNA3D technology developed at the Lawrence Livermore National Laboratory. DYNA3D became the company's premier product LS-DYNA, a general purpose nonlinear finite eleme... » read more

Hybrid Emulation Takes Center Stage


From mobile to networking to AI applications, system complexity shows no sign of slowing. These designs, which may contain multiple billion gates, must be validated, verified and tested, and it’s no longer possible to just throw the whole thing in a hardware emulator. For some time, emulation, FPGA-based prototyping, and virtual environments such as simulators have given design and verific... » read more

HW/SW Design At The Intelligent Edge


Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

Meanwhile, 35 Years Later…


At this year’s Design Automation Conference, held on June 3, 4 and 5 in Las Vegas and about 10 miles away from our head office in Las Vegas, Nevada, we celebrated our 35th anniversary with a resounding reaffirmation of our raison d’etre: the provision of verification solutions for some of industry’s most pressing challenges. We had on display a variety of solutions – both hardware ... » read more

Week In Review: Design, Low Power


ON Semiconductor completed its $946 million acquisition of Quantenna Communications, a San Jose-based company that specializes in Wi-Fi chips and software. Aldec introduced automatic UVM register generation to its Riviera-PRO verification platform. Riviera-PRO can now accept a CSV file or IP-XACT register description as an input and, working at the Register Abstraction Layer (RAL) of UVM, ou... » read more

Training Tomorrow’s Chip Designers


With technology advancing rapidly and the growing number of open R&D projects, there is an expanding need for qualified engineers. To make this possible, practical education needs to start much earlier than after graduation. One the best ways the EDA and semiconductor industry has embraced is encouraging engineering students to cooperate with experienced engineers, technologists and indu... » read more

Why IP Quality Is So Difficult To Determine


Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends up on how and where it is used and in part because even the best IP may work better in one system than another—even in chips developed by the same vendor. This has been one of the challenges with IP over the years. In many cases, IP is poorly characterized, regardless of whether that IP wa... » read more

IP Requires System Context At 6/5/3nm


Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

Week In Review: Design, Low Power


Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

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