Inevitable Bugs

By Brian Bailey - 29 Apr, 2020 - Comments: 3

Are bug escapes inevitable? That was the fundamental question that Oski Technology recently put to a group of industry experts. The participants are primarily simulation experts who, in many cases, help direct the verification directions for some of the largest systems companies. In order to promote free discussion, all comments have been anonymized, distilling the primary thoughts of the parti... » read more

The Story Behind Advanced Packaging, Heterogeneous Integration and Test

By FormFactor - 06 Apr, 2020 - Comments: 0

The introduction of AMD’S FIJI chip a few years ago marked an important technology turning point for the semiconductor industry. This revolutionary graphics product delivered capability and innovation by relying on the first commercial example of 2.5D heterogenous integration, featuring a GPU assembled with High-Bandwidth-Memory (HBM) using Through-Silicon-Via (TSV) interconnect and interpose... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 20 Mar, 2020 - Comments: 0

The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

HBM Issues In AI Systems

By Brian Bailey - 16 Mar, 2020 - Comments: 0

All systems face limitations, and as one limitation is removed, another is revealed that had remained hidden. It is highly likely that this game of Whac-A-Mole will play out in AI systems that employ high-bandwidth memory (HBM). Most systems are limited by memory bandwidth. Compute systems in general have maintained an increase in memory interface performance that barely matches the gains in... » read more

Power Management Becomes Top Issue Everywhere

By Ann Mutschler - 12 Mar, 2020 - Comments: 1

Power management is becoming a bigger challenge across a wide variety of applications, from consumer products such as televisions and set-top-boxes to large data centers, where the cost of cooling server racks to offset the impact of thermal dissipation can be enormous. Several years ago, low-power design was largely relegated to mobile devices that were dependent on a battery. Since then, i... » read more

Chip Design Is Getting Squishy

By Ed Sperling - 27 Feb, 2020 - Comments: 0

So many variables, uncertainties and new approaches are in play today across the chip industry today that previous rules are looking rather dated. In the past, a handful of large companies or organizations set the rules for the industry and established an industry roadmap. No such roadmap exists today. And while there are efforts underway to create new roadmaps for different industries, inte... » read more

Chiplet Momentum Rising

By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 21 Feb, 2020 - Comments: 0

AI The European Union put out a white paper about artificial intelligence. The United States Chief Technology Officer Michael Kratsios criticized the EU stance on Thursday as clumsy. "We found, what they actually put out yesterday, really, I think, in some ways clumsily attempts to bucket AI-powered technologies as either ‘high-risk’ or ‘not high-risk,’” he said, according to a news ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 21 Feb, 2020 - Comments: 0

Dialog Semiconductor will acquire Adesto Technologies for $12.55 per share in cash, or for approximately $500 million enterprise value. Founded in 2006 and based in Santa Clara, CA, Adesto provides application-specific semiconductors, embedded systems, and specialty memory for IoT and industrial IoT applications. “This acquisition substantially enhances our position in the Industrial IoT mark... » read more

EDA In The Cloud

By Ed Sperling - 18 Feb, 2020 - Comments: 0

Michael White, director of product marketing for Calibre physical verification at Mentor, a Siemens Business, looks at the growing compute requirements at 7, 5 and 3nm, why the cloud looks increasingly attractive from a security and capacity standpoint, and how the cloud as well as new lithography will affect the cost and complexity of developing new chips. » read more

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Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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