Manufacturing Bits: Nov. 17


Speedy nano-scale subs For years, researchers have been developing nano-scale submarines. In theory, nano-subs could be used in various applications. For example, they could navigate inside the human body and transport medicine to various organs. The problem? Most nano-subs use or generate toxic chemicals, according to researchers from Rice University. Seeking to solve the problem, Rice ... » read more

The Week In Review: Manufacturing


China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

The Week In Review: Manufacturing


Looking to propel the next wave of OLED displays, Applied Materials has rolled out two new systems. The tools enable the volume production of OLED displays for both mobile products and TVs. In addition, Applied Materials has shipped an Applied TopMet roll-to-roll metal deposition system to Jindal Poly Films, a leader in PET and BOPP films for flexible packaging and labeling applications. In... » read more

Security In 2.5D


The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no. Put in perspective, all chips are vulnerable to [getkc id="253" kc_name="side channel attacks"], hacking of memory—a risk that increases... » read more

Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

New Metrics For The Cloud


Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Rethinking Differentiation


Differentiation is becoming more difficult, more time-consuming, and in some cases much more expensive for chipmakers. The traditional metrics of faster performance, lower power and less area/cost, which are leftovers from the PC era, no longer are a guarantee of success despite the fact that they are still baseline metrics for many designs. Even new metrics such as ecosystem completeness, w... » read more

Advanced IC Packaging Biz Heats Up


After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

DVFS On The Sidelines


Power reduction is one of the most important aspects of chip design these days, but not all power reduction techniques are used equally. Some that were once important are fading and dynamic voltage, and frequency scaling (DVFS) is one of them. What's changed, and will we see a resurgence in the future? What is it? DVFS has physics powerfully in its favor. As Vinod Viswanath, director of res... » read more

The Week In Review: Manufacturing


IC Insights released its top-20 chip rankings in terms of sales for the first half of 2015. Samsung’s growth rate in 2Q ‘15 put the company closer to catching Intel, the world’s largest chipmaker. IC Insights also showed how the top-20 rankings would have looked if the proposed Avago/Broadcom and NXP/Freescale mergers were in place. Avago/Broadcom would have been ranked 7th and NXP/Freesc... » read more

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