Is The 2.5D Supply Chain Ready?


A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

New Metrics For The Cloud


Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Rethinking Differentiation


Differentiation is becoming more difficult, more time-consuming, and in some cases much more expensive for chipmakers. The traditional metrics of faster performance, lower power and less area/cost, which are leftovers from the PC era, no longer are a guarantee of success despite the fact that they are still baseline metrics for many designs. Even new metrics such as ecosystem completeness, w... » read more

Advanced IC Packaging Biz Heats Up


After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] stacked-die is entering the market. And on another front, the momentum is building for new and advanced 2D packages, such as embedded package-on-package (PoP... » read more

DVFS On The Sidelines


Power reduction is one of the most important aspects of chip design these days, but not all power reduction techniques are used equally. Some that were once important are fading and dynamic voltage, and frequency scaling (DVFS) is one of them. What's changed, and will we see a resurgence in the future? What is it? DVFS has physics powerfully in its favor. As Vinod Viswanath, director of res... » read more

The Week In Review: Manufacturing


IC Insights released its top-20 chip rankings in terms of sales for the first half of 2015. Samsung’s growth rate in 2Q ‘15 put the company closer to catching Intel, the world’s largest chipmaker. IC Insights also showed how the top-20 rankings would have looked if the proposed Avago/Broadcom and NXP/Freescale mergers were in place. Avago/Broadcom would have been ranked 7th and NXP/Freesc... » read more

Top 15 Integrating Points In The Continuum Of Verification Engines


The integration game between the different verification engines, dynamic and static, is in full swing. Jim Hogan talked about the dynamic engines that he dubbed “COVE”, and I recently pointed out a very specific adoption of COVE in my review of some customer examples at DAC 2015 in “Use Model Versatility Is Key for Emulation Returns on Investment”. Here are my top 15 integrating poin... » read more

The Week In Review: Manufacturing


Semicon West is always a busy week. Typically, there are a plethora of events going on during the week. It’s also a good week to get a pulse on the industry. The good news: Innovation is alive and well. Bad news: Intel cut its CapEx. And tool makers are in the midst of a lull right now, with a cloudy outlook projected for 2016. Some even see a dreaded downturn next year. Pacific Crest Secu... » read more

Week 49: Are We There Yet?


When I was a little kid my parents would pack me and my sister into the car and drive to the Mediterranean for our summer camping vacation. It was quite a haul from our home on the west side of Germany near the border with Belgium to the south of France, and as is true of any long car trip, the last stretch was the hardest. After hours in the backseat, my sister and I would be craning our necks... » read more

Changes In The Cloud


I wrapped up an exciting week last Friday at the inaugural NFV World Congress at the Doubletree Hotel in San Jose last week, where more than 1,000 stakeholders had gathered to convey, debate, discuss and learn about the vision for the next-generation cloud and networking infrastructure. One of the highlights of the week was the OPNFV mini-summit to communicate the tremendous progress that t... » read more

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