Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 May, 2023 - Comments: 0

Pervasive computing Microsoft and AMD are working together on an AI processor, according to a report in Bloomberg. Tenstorrent adopted Arteris IP’s Ncore and FlexNoC interconnect IP for its AI RISC-V chiplets. The chiplets will be configurable for different uses and workloads. Some use cases include AI high-performance computing for data center, such as cloud servers, and edge devices and... » read more

EDA Makes A Frenzied Push Into Machine Learning

By Ed Sperling - 27 Apr, 2023 - Comments: 0

Machine learning is becoming a competitive prerequisite for the EDA industry. Big chipmakers are endorsing and demanding it, and most EDA companies are deploying it for one or more steps in the design flow, with plans to add much more over time. In recent weeks, the three largest EDA vendors have made sweeping announcements about incorporating ML into their tools at their respective user eve... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 21 Apr, 2023 - Comments: 0

Pervasive computing Broadcom announced delivery of its Jericho3-AI fabric for artificial intelligence (AI) networks, which delivers 26 petabits per second of Ethernet bandwidth. That is roughly four times the bandwidth of the previous generation, at a 40% power savings per gigabit. AMD released the Ryzen Embedded 5000 Series processors for customers requiring power-efficient processors opt... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 07 Apr, 2023 - Comments: 0

South Korea slashed chip production in February by 17.7% compared to the previous month — 41.8% year-over-year, and the sharpest drop since 2008 — according to figures from South Korea’s National Statistics Office. Inventories were up 33.5%, while exports dropped by 41.6%. China launched a security probe into U.S. memory chipmaker Micron in apparent retaliation for U.S. restrictions on... » read more

Week In Review: Design, Low Power

By Jesse Allen - 07 Apr, 2023 - Comments: 0

MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Chiplet Security Risks Underestimated

By Ann Mutschler - 06 Apr, 2023 - Comments: 0

The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Mechanical Challenges Rise With Heterogeneous Integration

By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

The Race Toward Mixed-Foundry Chiplets

By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Mini-Consortia Forming Around Chiplets

By Ed Sperling - 20 Mar, 2023 - Comments: 0

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. These loosely aligned partnerships are working to develop LEGO-like integration models for highly specific applications and end markets. But they all are starting small, because it'... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: AMD

Week In Review: Auto, Security, Pervasive Computing

EDA Makes A Frenzied Push Into Machine Learning

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Design, Low Power

Chiplet Security Risks Underestimated

Mechanical Challenges Rise With Heterogeneous Integration

The Race Toward Mixed-Foundry Chiplets

Mini-Consortia Forming Around Chiplets

Week In Review: Semiconductor Manufacturing, Test