Challenges Of Heterogeneous Integration

By Ed Sperling - 13 Jul, 2023 - Comments: 0

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology, talks about a variety of issues ranging from uneven aging, warpage, and different mechanical stresse... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips

By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 16 Jun, 2023 - Comments: 0

Applied Materials sued its Chinese-owned rival, Mattson, over an alleged 14-month effort to steal valuable trade secrets, reports Bloomberg. In court filing, Applied Materials claimed that Mattson engaged in a spree of employee-poaching and covertly transferring semiconductor equipment designs. Global semiconductor materials revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous... » read more

Smart Manufacturing Makes Gains In Chip Industry

By Anne Meixner - 15 Jun, 2023 - Comments: 0

Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

High-Density Fan-Out Packaging With Fine Pitch Embedded Trace RDL

By WonChul Do - 15 Jun, 2023 - Comments: 0

The needs of high-performance devices for artificial intelligence (AI), high performance computing (HPC) and data center applications have drastically accelerated during the Covid-19 pandemic period. At the same time, the integrated circuit (IC) industry struggles to minimize the silicon technology node to satisfy the endless requirements of computing performance within tight cost constraints. ... » read more

Enhancing Punch MLF Packaging with Edge Protection Technology

By Amkor - 14 Jun, 2023 - Comments: 0

Quad Flat No-Lead (QFN) semiconductor packaging provides a small form factor as well as good electrical and thermal performance for low cost. Add demonstrated long term reliability to its benefits and it is easy to see why it has been a preferred automotive package for many years. QFNs are offered in saw and punch formats with punch being a well-defined and used solution in the automotive marke... » read more

Ramping Up Power Electronics For EVs

By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 19 May, 2023 - Comments: 0

Former Apple engineer Weibao Wang was indicted for stealing Apple’s autonomous vehicle hardware and software IP and giving the information to Chinese competitors. Among other items, authorities said they found source code for the project on the engineer’s personal laptop, which was seized at his home. Wang fled to China the same day a search warrant was executed. This is one of five cases b... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips

By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

Next Gen Laser Assisted Bonding (LAB) Technology

By SeokHo Na - 18 May, 2023 - Comments: 0

In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

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Knowledge Centers
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