tag: analytics

AI’s Power To Transform Semiconductor Design And Manufacturing
By John Kibarian - 28 Oct, 2024 - Comments: 0

Artificial intelligence and machine learning (AI/ML) have immense power to transform semiconductor design and manufacturing for a variety of broad and far-ranging applications. Just consider the volume of data generated by design and manufacturing each year. With increasingly complex products, machines, processes and supply chains, the overall amount of data associated with semiconductor making... » read more

IC Industry’s Growing Role In Sustainability
By Ann Mutschler - 17 Jun, 2024 - Comments: 1

The massive power needs of AI systems are putting a spotlight on sustainability in the semiconductor ecosystem. The chip industry needs to be able to produce more efficient and lower-power semiconductors. But demands for increased processing speed are rising with the widespread use of large language models and the overall increase in the amount of data that needs to be processed. Gartner estima... » read more

IC Test And Quality Requirements Drive New Collaboration
By Laura Peters - 09 Apr, 2024 - Comments: 0

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how chips are tested and monitored. At the core of this shift is a growing recognition that no company can do everything, and that to work together will require much tighter integration of flows, met... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Improving Reliability In Chips
By Anne Meixner - 12 Sep, 2023 - Comments: 1

Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; and Uzi Baruch, chief strategy officer at proteanTecs. What follows are excerpts of t... » read more

Challenges In Ramping New Manufacturing Processes
By Ed Sperling - 30 Aug, 2023 - Comments: 0

Despite a slowdown for Moore’s Law, there are more new manufacturing processes rolling out faster than ever before. The challenge now is to decrease time to yield, which involves everything from TCAD and design technology co-optimization, to refinement of power, performance, area/cost, and process control and analytics. Srinivas Raghvendra, vice president of engineering at Synopsys, talks abo... » read more

AI Process Control Platform Enabling Next Generation Technology
By Tignis - 16 Aug, 2023 - Comments: 0

PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

SiC Growth For EVs Is Stressing Manufacturing
By Anne Meixner - 08 Aug, 2023 - Comments: 0

The electrification of vehicles is fueling demand for silicon carbide power ICs, but it also is creating challenges in finding and identifying defects in those chips. Coinciding with this is a growing awareness about just how immature SiC technology is and how much work still needs to be done — and how quickly that has to happen. Automakers are pushing heavily into electric vehicles, and t... » read more

Pinpointing Timing Delays in Complex SoCs
By Anne Meixner - 11 Jul, 2023 - Comments: 0

Telemetry circuits are becoming a necessity in complex heterogeneous chips and packages to show how these devices are behaving post-production, but fusing together relevant data to identify the sources of problems adds its own set of challenges. In the past, engineering teams could build margin into chips to offset any type of variation. But at advanced nodes and in advanced packages, tolera... » read more

What Data Center Chipmakers Can Learn From Automotive
By Anne Meixner - 11 Apr, 2023 - Comments: 2

Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, but systems companies are looking to emulate that level of quality for their data center SoCs. Building to that quality level is more expensive up front, although ultimately it can save costs versus having to ... » read more

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