tag: ANSYS

Blog Review: Feb. 11
By Jesse Allen - 11 Feb, 2015 - Comments: 0

Ansys' Bill Vandermark flags the top five engineering articles of the week. Check out the one about the latest attempt at cold fusion, which left researchers hiding behind a blast shield. The solar-powered car named Stella drove away with the prestigious "Best Technology Achievement" award at the 8th annual Crunchies Awards this week. NXP's Maurice Geraets sounds like a proud parent – with... » read more

One-On-One: Walid Abu-Hadba
By Ed Sperling - 11 Feb, 2015 - Comments: 0

Walid Abu-Hadba, chief product officer at [getentity id="22021" e_name="Ansys"] (and a former top executive at Microsoft), sat down with Semiconductor Engineering to talk about systems engineering and why the starting point is no longer the SoC. What follows are excerpts of that conversation. SE: How do you define system? Abu-Hadba: It's everything. It's the entire product and where the p... » read more

The Week In Review: Design/IoT
By Jesse Allen - 06 Feb, 2015 - Comments: 0

Mergers & Acquistions Silicon Labs acquired Bluegiga Technologies Oy, providers of short-range wireless connectivity solutions and software for the IoT based in Espoo, Finland. Intel signed a definitive agreement to acquire Lantiq, a supplier of broadband access and home networking technologies based in Munich, Germany. Tools Mentor Graphics announced the addition of Automotive ... » read more

Blog Review: Feb. 4
By Jesse Allen - 04 Feb, 2015 - Comments: 0

After the Super Bowl, Ansys' Thierry Marchal looks at making football safer through virtual prototyping. Sports concussions are a serious danger for athletes from youths to professionals, and modeling head and brain impacts may lead not only to safer football helmets but a better understanding of how to lower the chance of brain injuries in sports. Synopsys' Ray Varghese continues his series... » read more

New Market Expectations For 2015
By Brian Bailey - 29 Jan, 2015 - Comments: 0

This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Blog Review: Jan. 28
By Ed Sperling - 28 Jan, 2015 - Comments: 0

Mentor Graphics' John Day points to the growing presence of automakers in Silicon Valley. The latest émigré is Ford, which is setting up a research and innovation center in Palo Alto, but the company is hardly alone. Electronics could well become the real differentiators in vehicles. ARM's Andrew Sloss points to an intriguing relationship between data and economic growth—not to mention m... » read more

Blog Review: Jan. 21
By Ed Sperling - 21 Jan, 2015 - Comments: 0

Mentor's John Day attended the IBM talk at last week's Automotive News World Congress in Detroit. The upshot: The automotive industry is ripe for disruptive changes, but autonomous vehicles aren't likely to be part of those changes. Cadence's Axel Scherer spins a tale of movie and electronic magic, with a little debug technology thrown in—and notes how quickly things that seemed magical a... » read more

Designing For Automotive
By Ann Mutschler - 15 Jan, 2015 - Comments: 0

As cars include an increasing amount of electronics and electronics subsystems, the number of design challenges involving reliability, cost and power are on the rise. “Reliability tops the list of concerns for the design team because when you put these electronics in, you must know if they are going to operate efficiently by themselves," said Aveek Sarkar, vice president of product enginee... » read more

IP Design Essentials For Reliability And SoC Integration
By Annapoorna Krishnaswamy - 15 Jan, 2015 - Comments: 0

IP is integral to every SoC design. The need for ubiquitous connectivity has pushed the threshold for content in SoCs even beyond the tenets of Moore’s Law. Technology scaling has not only enabled the delivery of increased performance and reduced power, but also rich content through the integration of a wide range of IPs such as radio devices, CMOS image sensors, MEMs, etc., into a single ... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Ansys - 14 Jan, 2015 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially finFET-based devices. These advanced technology nodes allow chips to operate... » read more

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