tag: ANSYS

Week In Review: Design, Low Power
By Susan Rambo - 16 Jun, 2023 - Comments: 0

Intel released Tunnel Falls, its newest quantum research chip, to quantum computing researchers interested in using the 12-qubit silicon chip for their own experiments and research.  Intel is also providing the chips to research laboratories, with help from LQC (LPS Qubit Collaboratory) through the Army Research Office. The first labs to receive the chip are LPS, Sandia National Laboratories, ... » read more

CEO Outlook: Chiplets, Data Management, And Reliability
By Ed Sperling - 14 Jun, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about changes in chip design with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; ... » read more

Blog Review: June 14
By Jesse Allen - 14 Jun, 2023 - Comments: 0

Synopsys' Richard Solomon and Gary Ruggles examine the Compute Express Link (CXL) protocol and how it could unlock new ways of doing computing such as enabling efficient heterogeneous computing architectures, accelerating data-intensive workloads, and facilitating advanced real-time analytics. Cadence's Andre Baguenie explains how to convert an electrical signal to a logic value using the Ve... » read more

EDA’s Role Grows For Preventing And Identifying Failures
By Karen Heyman - 08 Jun, 2023 - Comments: 0

The front end of design is becoming more tightly integrated with the back end of manufacturing, driven by the rising cost and impact of failures in advanced chips and critical applications. Ironically, the starting point for this shift is failure analysis (FA), which typically happens when a device fails to yield, or worse, when it is returned due to some problem. In production, that leads t... » read more

4 Ways To Design More Reliable Automotive Electronics
By David Dang - 08 Jun, 2023 - Comments: 0

From engine management systems (fuel injection rate, emissions control, cooling systems) and autonomous controls (lane, speed, park assist, adaptive cruise control) to infotainment systems and comfort systems (climate control, electronic seat adjustment, automatic wipers, etc.), the modern-day gas-powered and electric vehicles have more electronic devices than ever. Indeed, the microprocessors ... » read more

Cold Plate Technology Comparison
By Ansys - 07 Jun, 2023 - Comments: 0

New types of energy, such as wind and solar power, are being utilized more prevalently and hybrid cars/buses are being identified as a means of reducing carbon dioxide emissions resulting from the use of fossil fuels. Electronic systems like frequency converters for wind power and train utilization are required to provide ever higher levels of energy savings. As such, IGBT (insulated-gate bipol... » read more

Blog Review: June 7
By Jesse Allen - 07 Jun, 2023 - Comments: 0

Synopsys' Kenneth Larsen and Powerchip's S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density. In a podcast, Siemens' Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing co... » read more

Blog Review: May 31
By Jesse Allen - 31 May, 2023 - Comments: 0

Cadence's Moshik Rubin looks at how the Portable Test and Stimulus Standard (PSS) is finding new use cases in ATE production test by enabling creation of a rich set of functional test scenarios in a reusable way. Synopsys' LJ Chen and Dana Neustadter check out the latest version of the Universal Flash Storage (UFS) standard, which doubles the data transfer rate of the preceding UFS 3.1 solut... » read more

Week In Review: Design, Low Power
By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

Chip Design CEO Outlook
By Ed Sperling - 25 May, 2023 - Comments: 0

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Digital Industries Software; John Kibarian, president and CEO of PDF Solutions; John Lee, general manager and vice president of Ansys' Semiconductor Business Unit; Niels Faché, vice president and general manager of PathWave Software Solutions at Keysight; Dean Drako, president and CEO of IC M... » read more

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