tag: ANSYS

3D-IC Design: An Innovative Approach To Chip Integration
By Akanksha Soni - 11 May, 2023 - Comments: 0

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient devices, the industry has shifted toward 3D-IC design. 3D-ICs have many applications in a wide range of industries, including consumer electronics, telecommunications, computing, and automotive. Wh... » read more

Engineering Simulation Workloads And The Rise of the Cloud
By Ansys - 10 May, 2023 - Comments: 0

Cloud service providers (CSPs) continue to improve the performance capabilities of their non-accelerated and accelerated compute instances, as well as augment their HPC infrastructure with domain-area expertise of targeted HPC workloads. Additionally, engineers, researchers, and scientists are becoming more comfortable with the types of workloads that can be run in the cloud within acceptable w... » read more

Blog Review: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 05 May, 2023 - Comments: 0

The global sales slump in semiconductors but may be stabilizing, according to a new report from the Semiconductor Industry Association (SIA). Worldwide sales of semiconductors fell 8.7% in Q1 2023 compared to the Q4 2022, and dropped 21.3% compared to the Q1 2022. Sales for the month of March 2023 increased 0.3% compared to February 2023. Meanwhile, SEMI reports worldwide silicon wafer shipment... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2023 - Comments: 0

Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

AI Adoption Slow For Design Tools
By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 28 Apr, 2023 - Comments: 0

The U.S. Commerce Department  launched Chips.gov, a website that covers all aspects of the CHIPS Act, including funding opportunities and job openings. In similar vein, Intel CEO Pat Gelsinger focused on the future of semiconductor manufacturing in America in a talk at MIT. Intel has committed to expanding semiconductor manufacturing in the U.S., including spending an initial $20 billion on ne... » read more

Week In Review: Design, Low Power
By Jesse Allen - 28 Apr, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Apr, 2023 - Comments: 0

Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

EDA Makes A Frenzied Push Into Machine Learning
By Ed Sperling - 27 Apr, 2023 - Comments: 0

Machine learning is becoming a competitive prerequisite for the EDA industry. Big chipmakers are endorsing and demanding it, and most EDA companies are deploying it for one or more steps in the design flow, with plans to add much more over time. In recent weeks, the three largest EDA vendors have made sweeping announcements about incorporating ML into their tools at their respective user eve... » read more

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