tag: ANSYS

17 Equations That Changed The World
By Ansys - 08 Mar, 2023 - Comments: 0

Mathematics has been a constant part of our lives forever and is used in many ways in our everyday lives. Created by Ian Stewart, listed on Dr. Paul Coxon’s Twitter account, and discussed on mathematics blogger Larry Philip’s site is a list of the “17 Equations that Changed the World,” many of which have been mentioned on The Big Bang TheoryTV series. However, the list is incomplete.... » read more

Standards: The Next Step For Silicon Photonics
By Karen Heyman - 07 Mar, 2023 - Comments: 0

Testing silicon photonics is becoming more critical and more complicated as the technology is used in new applications ranging from medicine to cryptography, lidar, and quantum computing, but how to do that in a way that is both consistent and predictable is still unresolved. For the past three decades, photonics largely has been an enabler for high-speed communications, a lucrative market t... » read more

Blog Review: March 1
By Jesse Allen - 01 Mar, 2023 - Comments: 0

Siemens EDA's Chris Spear explains the UVM Factory and how it can facilitate collaboration by enabling injection of new features without affecting your team. Cadence's Paul McLellan looks at efforts to ensure chiplets from different companies work together, particularly when the creating companies didn't pre-plan for those specific chiplets to work together, as well as the problems of failur... » read more

How To Build Resilience Into Chips
By Ed Sperling and Ann Mutschler - 27 Feb, 2023 - Comments: 0

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

Taming Corner Explosion In Complex Chips
By Brian Bailey - 23 Feb, 2023 - Comments: 0

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Blog Review: Feb. 22
By Jesse Allen - 22 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster observes that the FPGA market continues to go through a similar complexity curve that the IC/ASIC market experienced in the early and mid-2000 timeframe. Synopsys' Mitch Heins explores the benefits of heterogeneous integration of lasers and active gain elements in a silicon-based photonic IC, including reduced system costs, size, weight, and power along with improv... » read more

Blog Review: Feb. 15
By Jesse Allen - 15 Feb, 2023 - Comments: 0

Siemens EDA's Harry Foster examines the relationship between verification maturity and non-trivial bug escapes into production, as well as whether safety critical development processes yield higher quality in terms of preventing bugs and achieving silicon success. Synopsys' Shankar Krishnamoorthy finds that the rapid progress of machine learning models is driving demand for more domain-speci... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Feb, 2023 - Comments: 0

Arm is heading for an IPO this year, with plans "fairly well developed and underway now," CEO Rene Haas told Reuters. Arm reported fiscal Q3 revenue of $746 million, up 28% compared with the same period in 2021, setting the stage for a public offering. The company noted it had double- or triple-revenue increases in automotive, consumer, infrastructure, and IoT. The Si2 Compact Model Coalit... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Feb, 2023 - Comments: 0

General Motors (GM) made a deal with GlobalFoundries (GF) to have chips made at the U.S.-based foundry in upstate New York for GM’s key suppliers. GF will expand its production capabilities exclusively for GM’s supply chain, while GM promises to bring economies of scale through its strategy to reduce the unique types of chips needed in products. J.D. Power released its 2023 U.S. Vehicle ... » read more

Chiplets Taking Root As Silicon-Proven Hard IP
By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

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