Ansys SPEOS: Illuminating The Possibilities


Ansys SPEOS enables optical engineers to fine-tune critical factors such as propagation, reflection, visibility and legibility, while also identifying problems such as glare and hot spots. In a broad range of applications in the automotive, aerospace and general lighting segments, SPEOS cuts significant time and expense from the design cycle, while supporting the high degree of innovation neede... » read more

Blog Review: April 8


Synopsys' Taylor Armerding shares some tips for getting development, security, and operations teams communicating effectively and working toward a single purpose. Cadence's Paul McLellan looks back over computing history to how the best way to deliver computing resources has shifted from cloud to edge and back again. Mentor's Shivani Joshi shares an overview of flexible PCB designs and wh... » read more

Reliability Challenges Grow For 5/3nm


Ensuring that chips will be reliable at 5nm and 3nm is becoming more difficult due to the introduction of new materials, new transistor structures, and the projected use of these chips in safety- and mission-critical applications. Each of these elements adds its own set of challenges, but they are being compounded by the fact that many of these chips will end up in advanced packages or modul... » read more

COVID-19 Tech Bits


Tech companies, consortiums and universities are jumping in to help fight COVID-19, deploying everything from massive computing capabilities to developing new technologies that can protect medical workers and first responders. Nearly all of these have ramped up over the past several weeks, as the tech world begins to take on a global challenge to combat the deadly virus. Compute resources... » read more

Week In Review: Auto, Security, Pervasive Computing


Synopsys has added nanoscale and macroscale illumination optics to its RSoft Photonic Device Tools version 2020.03. ARVR designers can use the RSoft-LightTools Bidirectional Scattering Distribution Function (BSDF) interface to make interpolated BSDF files for optimized nanoscale and macroscale optics, such as freeform optical prism projectors, eye tracking technologies, and optical planar waveg... » read more

Blog Review: April 1


Rambus' Steven Woo takes an in-depth look at on-chip memory for high performance AI applications and explores some of the primary differences between HBM and GDDR6. Synopsys' Taylor Armerding warns of the risks of legacy vulnerabilities, where software has problems that were never fixed then forgotten about or never discovered in the first place, and key steps for finding and addressing them... » read more

Blog Review: March 25


Rambus' Steven Woo checks out common memory systems that are used in the highest performance AI applications and points to the differences between on-chip memory, HBM, and GDDR. Mentor's Colin Walls considers whether software for embedded systems should be delivered as a binary library or source code and warns of some key potential issues when requesting source code. A Synopsys writer poi... » read more

Week In Review: Design, Low Power


Silicon Labs will acquire Redpine Signals' Wi-Fi and Bluetooth business, development center in Hyderabad, India, and extensive patent portfolio for $308 million in cash. Silicon Labs says the acquisition will expand the company's IoT wireless technology, including smart phone and industrial IoT, and accelerate its roadmap for Wi-Fi 6. The deal is expected to close in the second quarter of 2020.... » read more

Week In Review: Auto, Security, Pervasive Computing


National Instruments is offering free online training courses to anyone anywhere, until the end of April to help support the engineering community during COVID-19 crisis. Some instructor-led virtual training is available at reduced cost. NIWeek has been postponed this year until August 3-5, 2020. Click here for more news about how the semiconductor industry is handling COVID-19. AI, machi... » read more

Blog Review: March 18


Arm's Divya Prasad investigates whether power rails that are buried below the BEOL metal stack and back-side power delivery can help alleviate some of the major physical design challenges facing 3nm nodes and beyond. Rambus' Steven Woo takes a look at a Roofline model for analyzing machine learning applications that illustrates how AI applications perform on Google’s tensor processing unit... » read more

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