Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

What Will Intel Do Next?

By Ed Sperling - 27 Sep, 2018 - Comments: 2

The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI accelerators, as well as a field of embedded FPGA vendors, a couple of discrete FPGA makers, and a slew of soft processor cores. This certainly hasn't been lost on Intel. As the world's largest... » read more

Betting Big On Discontinuity

By Ed Sperling - 27 Sep, 2018 - Comments: 0

Wally Rhines, president and CEO of Mentor, a Siemens Business, sat down with Semiconductor Engineering to talk about the booming chip industry, what's driving it, how long it will last and what changes are ahead in EDA and chip architectures. What follows are excerpts of that conversation. SE: The EDA and semiconductor industries are doing well right now. What's driving that growth? Rhine... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Sep, 2018 - Comments: 0

Tariffs The Office of the U.S. Trade Representative (USTR) has released a list of $200 billion worth of Chinese imports that will be subject to tariffs. These actions are on top of another set of tariffs, which were put in place. The additional tariffs will be effective starting Sept. 24, and initially will be in the amount of 10%. Starting Jan. 1, 2019, the level of the additional tariffs wi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Sep, 2018 - Comments: 0

Internet of Things Release 3 is published by oneM2M, the worldwide Internet of Things interoperability standards initiative. The third set of specifications deals with 3GPP interworking, especially as it relates to cellular IoT connectivity, among other features. The release is said to enable seamless interworking with narrowband IoT and LTE-M connectivity through the 3GPP Service Capability E... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Sep, 2018 - Comments: 0

Internet of Things NXP Semiconductors provided its A71CH trust anchor to Google IoT Cloud, enabling authentication for Google IoT Cloud Core. The technology helps to secure edge devices for Internet of Things deployments. Separately, NXP announced the promotion of Kurt Sievers, executive vice president and general manager of the chip company’s automotive business, to president of NXP Semicon... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Sep, 2018 - Comments: 0

Internet of Things Silicon Labs worked with Norway’s Q-Free to create the ParQSense Smart Parking Sensor, which helps drivers find available outdoor parking spaces. ParQSense uses the chip company’s Wonder Gecko wireless microcontroller for connectivity and control. Having gone through pilot testing in the European Union and North America this year, ParQSense is being released for commerci... » read more

Cracking The Auto IC Market

By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

Is Software Necessary?

By Brian Bailey - 27 Aug, 2018 - Comments: 0

Hardware must be capable of running any software. While that might have been a good mantra when chips were relatively simple, it becomes an impossible verification task when dealing with SoCs that contain dozens of deeply embedded processors. When does it become necessary to use production software and what problems can that get you into? When verification targets such as power are added, it... » read more

Old Vs. New Packages

By Jeff Dorsch - 15 Aug, 2018 - Comments: 2

Over the years, the semiconductor industry has witnessed a parade of packaging innovations, such as system-in-package, semiconductor embedded in substrate, and fan-out wafer-level packaging. Two interesting packaging innovations are now being used in the process of miniaturizing microchips and electronics. One is a new concept that combines two tried-and-true technologies. The other is a de... » read more

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tag: Apple

Week in Review: IoT, Security, Auto

What Will Intel Do Next?

Betting Big On Discontinuity

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Cracking The Auto IC Market

Is Software Necessary?

Old Vs. New Packages

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