tag: Apple

Advanced Packaging Is Suddenly Very Cool
By Ed Sperling - 11 Dec, 2017 - Comments: 2

The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The IoT Is Alive And Well
By Ed Sperling - 07 Dec, 2017 - Comments: 0

There has been a lot of grumbling lately about the IoT and how it has failed to live up to expectations. But the problem may be less about the success of the IoT than the ability of any group of chipmakers and manufacturers to capitalize on its success. The IoT has been growing steadily since the term was first coined by Kevin Ashton, who began using RFID inside of Procter & Gamble to ma... » read more

A Better Way To Connect The Home
By Sree Durbha - 07 Dec, 2017 - Comments: 0

The concept of a fully ‘connected home’ has been discussed for more than 20 years. However, widespread proliferation has taken far longer than anyone could have originally imagined. For a long time, deployment activity seemed to be limited to a relatively small number of high value installations. These installations were generally complicated to implement and their operation was not very us... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Dec, 2017 - Comments: 0

Chipmakers The 2017 top-ten rankings of foundries remain the same as last year, according to TrendForce. TSMC, GlobalFoundries and United Microelectronics Corp. (UMC) rank first, second, and third, respectively, in terms of projected sales in 2017, according to TrendForce. TSMC has a dominant market share of 55.9%. In the rankings, Samsung is in fourth place, followed in order by SMIC, TowerJa... » read more

More Volatility Ahead
By Ed Sperling - 30 Nov, 2017 - Comments: 0

The entire semiconductor industry had a wild ride on the stock market this week, plunging on Wednesday and recovering on Thursday. This is just a sign of things to come. The cause of this week's volatility can be tied directly to a Morgan Stanley report, which said that NAND prices have peaked and will begin dropping at the beginning of 2018 because supply has caught up with demand. The repo... » read more

Five Trends In IC Packaging
By Mark LaPedus - 16 Nov, 2017 - Comments: 0

At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

Litho Options For Panel Fan-out
By Mark LaPedus - 06 Nov, 2017 - Comments: 2

Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy