tag: Applied Materials

Blog Review: March 10
By Jesse Allen - 10 Mar, 2021 - Comments: 0

Siemens EDA's Harry Foster checks out how the maturity of verification processes impact bug escapes in FPGA designs and whether safety critical development processes prevent bugs from escaping to silicon. Synopsys' Dennis Kengo Oka examines the weaknesses and vulnerabilities in automotive keyless entry systems and how security researchers hacked the Tesla Model X key fob. Cadence's Paul M... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Mar, 2021 - Comments: 0

Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

Week In Review: Design, Low Power
By Jesse Allen - 26 Feb, 2021 - Comments: 0

Cadence completed the acquisition of NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. Founded in 1993 as a spin-off of the Vrije Universiteit Brussel (VUB), NUMECA was based in Brussels, Belgium. Terms of the deal were not disclosed... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Feb, 2021 - Comments: 0

Chipmakers and OEMs A severe winter storm has hit many parts of the United States, including Texas. In Austin, utility providers are prioritizing service to residential areas. As a result, electricity and natural gas providers have temporarily suspended service to Austin’s semiconductor manufacturers, including Samsung and NXP. "Due to the recent blackouts in Texas, Samsung Austin Semicon... » read more

Manufacturing Bits: Feb. 16
By Mark LaPedus - 16 Feb, 2021 - Comments: 0

Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for chip-packaging applications. The group, called the Chip-to-Wafer (C2W) Hybrid Bonding Consortium, includes A*STAR’s IME organization, Applied Materials, ASM Pacific, Capcon, HD MicroSystems, ONT... » read more

Stronger, Better Bonding In Advanced Packaging
By Katherine Derbyshire - 21 Jan, 2021 - Comments: 1

System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less practical. In thermocompression bonding, protruding copper bumps bond to pads on the underlying substrate. In hybrid bonding, copper pads are inlaid in a dielectric, reducing the risk of oxidation. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Jan, 2021 - Comments: 0

Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China is expected to fall far short of its “Made in China 2025” goals for IC production, according to IC Insights. “IC Insights forecasts China-produced ICs will represent only 19.4% of its I... » read more

Blog Review: Dec. 23
By Jesse Allen - 23 Dec, 2020 - Comments: 0

Cadence's Paul McLellan checks out how Arm is becoming a powerhouse in the server and high-end space with the addition of new R&D and a focus on getting the most out of its architecture. Siemens EDA's Harry Foster continues his look at verification trends in FPGAs by checking out adoption of different simulation and formal technologies. Synopsys' Taylor Armerding looks ahead to 2021 w... » read more

200mm Demand Surges
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Nov, 2020 - Comments: 0

Chipmakers and OEMs Apple has introduced a new MacBook Air, 13-inch MacBook Pro, and Mac mini powered by the M1, the first in a family of chips designed by Apple specifically for the Mac. Based on a 5nm process from TSMC, the M1 is packed with 16 billion transistors, the most Apple has ever put into a chip. It features a CPU core, graphics, AI and other functions all in the same chip. In total... » read more

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