tag: Applied Materials

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Co-Design For The AI Era
By Buvna Ayyagari-Sangamalli - 17 Dec, 2019 - Comments: 0

Welcome to the second piece in our blog series examining how the computing industry can work in new ways to enable the AI Era. In our first blog, my colleague Ellie Yieh described the enormous opportunities and challenges facing the industry as we enter a new decade, and she offered a path for accelerating innovation—from materials to systems—based on a “New Playbook” for driving im... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

Blog Review: Nov. 27
By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Nov, 2019 - Comments: 0

Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

DRAM Scaling Challenges Grow
By Mark LaPedus - 21 Nov, 2019 - Comments: 5

DRAM makers are pushing into the next phase of scaling, but they are facing several challenges as the memory technology approaches its physical limit. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. There are efforts in R&D to extend the technology, and ultimate... » read more

A New Playbook For The AI Era
By Ellie Yieh - 21 Nov, 2019 - Comments: 0

It’s Q4 in Silicon Valley, which means that most tech enterprises are in strategic planning mode, taking stock of where they are today and charting a course for where they want to be over the next few years. This year’s Q4 planning cycle needs to be a little different: the opportunities before us are an order of magnitude larger. So are the challenges. To get to where we need to be, our�... » read more

Foldable Phones Bend The Limits Of Technology
By Applied Materials - 21 Nov, 2019 - Comments: 0

After years of discussion about flexible, bendable displays for mobile electronic devices, the first and most logical of these devices, foldable phones, will hit the market this year — along with some as yet unresolved issues and challenges. Early adopters welcome the introduction of such exciting new technologies (figure 1). But from a broad industry standpoint, which mobile phone designs wi... » read more

Blog Review: Nov. 20
By Jesse Allen - 20 Nov, 2019 - Comments: 0

Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

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