tag: Applied Materials

Blog Review: Feb. 5
By Jesse Allen - 05 Feb, 2020 - Comments: 0

Cadence's Paul McLellan checks out the different ways persistent memories can be used, as well as a basic persistent programming model and key things hardware needs to support. In a video, Mentor's Colin Walls explains what's different about operating systems for embedded applications and how to go about selecting one. Synopsys' Taylor Armerding finds troubling vulnerabilities in U.S. cri... » read more

SiC Foundry Business Emerges
By Mark LaPedus - 23 Jan, 2020 - Comments: 1

Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

AI And Big Data Set To Reinvent Semiconductor Industry
By Regina Freed - 23 Jan, 2020 - Comments: 0

The recent IEEE International Electron Devices Meeting (IEDM) reaffirmed that the semiconductor industry is in a period of reinvention as we grapple with the challenges and opportunities promised by the Internet of Things (IoT), Big Data and AI. That such change is underway was made evident by a panel I was honored to moderate titled, “The Future of Logic: EUV is Here, Now What?” Joining... » read more

Finding Defects In EUV Masks
By Mark LaPedus - 23 Jan, 2020 - Comments: 0

Extreme ultraviolet (EUV) lithography is finally in production at advanced nodes, but there are still several challenges with the technology, such as EUV mask defects. Defects are unwanted deviations in chips, which can impact yield and performance. They can crop up during the chip manufacturing process, including the production of a mask or photomask, sometimes called a reticle. Fortunately... » read more

5/3nm Wars Begin
By Mark LaPedus - 23 Jan, 2020 - Comments: 6

Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at 3nm and beyond. The decision involves the move to extend today’s finFETs to 3nm, or to implement a new technology called gate-all-around FETs (GAA FETs) at 3nm or 2nm. An evolutionary step f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Jan, 2020 - Comments: 0

Fab tools, chips and technologies What happened at the SEMI Industry Strategy Symposium (ISS) this week? The annual three-day conference of executives gave the year’s first comprehensive outlook of the global electronics manufacturing industry. Click here to see the details. CyberOptics has unveiled its new WaferSense Auto Resistance Sensor (ARS) and its CyberSpectrum software. The produc... » read more

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2020 - Comments: 0

Cadence's Paul McLellan looks back at the history of lithography, from its fundamental equation to multiple patterning and the challenges facing EUV today. Synopsys' Taylor Armerding warns that medical device security isn't keeping up with new threats, despite positive steps, due in part to lack of funding, delayed initiatives, and a focus on critical service delivery. In a video, Mentor'... » read more

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Co-Design For The AI Era
By Buvna Ayyagari-Sangamalli - 17 Dec, 2019 - Comments: 0

Welcome to the second piece in our blog series examining how the computing industry can work in new ways to enable the AI Era. In our first blog, my colleague Ellie Yieh described the enormous opportunities and challenges facing the industry as we enter a new decade, and she offered a path for accelerating innovation—from materials to systems—based on a “New Playbook” for driving im... » read more

What’s Next For High Bandwidth Memory
By Mark LaPedus - 17 Dec, 2019 - Comments: 1

A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In systems, for example, data moves back and forth between the processor and DRAM, which is the main memory for most chips. But at times this exchange causes latency and power consumption, sometimes re... » read more

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