tag: Applied Materials

Searching For EUV Mask Defects
By Mark LaPedus - 19 Oct, 2017 - Comments: 2

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

Improving Optical Overlay And Measurement
By Adam Ge - 19 Oct, 2017 - Comments: 0

By Adam Ge and Shimon Levi Patterning challenges for the semiconductor industry are growing as the number of multi-patterned layers being used in the 10nm and beyond nodes increase. Patterning requires highly accurate overlay which has always been an issue, but with the added complexities of multi-patterning, smaller dimensions and subsequent tightening overlay error budget, it is now a majo... » read more

MEMS Market Shifting
By Ed Sperling - 19 Oct, 2017 - Comments: 0

The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

Next-Gen Mask Writer Race Begins
By Mark LaPedus - 19 Oct, 2017 - Comments: 5

Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the industry by acquiring IMS Nanofabrication, a multi-beam e-beam mask writer equipment vendor. Also last year, IMS, now part of Intel, began shipping the world’s first multi-beam mask writer f... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 13 Oct, 2017 - Comments: 0

Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

Blog Review: Oct. 11
By Jesse Allen - 11 Oct, 2017 - Comments: 0

Mentor's Matthew Balance examines the separation of concerns between test intent and test realization in the Portable Stimulus specification. Synopsys' Deepak Nagaria checks out the features that makes LPDDR4 efficient in terms of power consumption, bandwidth utilization, data integrity and performance. Cadence's Meera Collier listens in as Chris Rowen considers whether AI processing shou... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Oct, 2017 - Comments: 0

Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the technological advances and some of the biggest challenges engineers face in 2018. The report from NI looks at the following topics—machine learning; test challenges for 5G; IIoT; and effects of... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Sep, 2017 - Comments: 0

Chipmakers Who will buy Toshiba’s memory business? In the latest of what is becoming a confusing saga, Toshiba has signed a deal to sell its memory unit to a group led by Bain Capital. The Bain-led consortium will hold a 49.9% stake in the memory unit, while Toshiba will hold 40.2% and Japan’s Hoya will own 9.9%. Other members in the group include Apple, Dell, Kingston, and Seagate. In add... » read more

Blog Review: Sept. 27
By Jesse Allen - 27 Sep, 2017 - Comments: 0

Synopsys' Mukul Dawar highlights the biggest changes coming to the PCIe 4.0 specification, plus a peek at what's new in PCIe 5.0. Cadence's Paul McLellan considers why EDA startups are less common than they used to be. Mentor's David Abercrombie and Alex Pearson discuss new requirements for detecting double patterning errors at advanced nodes. Rambus' Aharon Etengoff reports that secur... » read more

Looming Issues And Tradeoffs For EUV
By Mark LaPedus - 25 Sep, 2017 - Comments: 5

Momentum is building for extreme ultraviolet (EUV) lithography, but there are still some major challenges to solve before this long-overdue technology can be used for mass production. [gettech id="31045" comment="EUV"] lithography—a next-generation technology that patterns tiny features on a chip—was supposed to move into production around 2012. But over the years, EUV has encountered se... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy