tag: Applied Materials

The Week In Review: Manufacturing
By Mark LaPedus - 23 May, 2014 - Comments: 1

About 150 to 200 employees from IBM’s chip unit will be dispatched to work at GlobalFoundries, according to the Poughkeepsie Journal. GlobalFoundries said the arrangement is temporary, according to the report. GlobalFoundries is the leading candidate to buy IBM’s chip unit, which is apparently on the block. To date, however, GlobalFoundries and IBM have yet to make any announcements on the... » read more

Blog Review: May 21
By Ed Sperling - 21 May, 2014 - Comments: 0

Mentor’s Colin Walls offers up some new insights into C++ exception handling, thanks to some input from colleague Jonathan Roelofs. This one involves minimizing overhead and reducing runtime penalties. Synopsys’ Mick Posner is back in the saddle again—literally. This is about as green as it gets. Cadence’s Arthur Marris reports back on the IEEE 802.3 Ethernet standards meeting, in... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 May, 2014 - Comments: 0

IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

New Materials Era In Advanced Interconnects
By Kavita Shah - 15 May, 2014 - Comments: 0

By Kavita Shah Growth in semiconductors today is driven primarily by mobile applications and this demand continues to increase with no slowdown in sight. Supporting this trend, chipmakers continue adding smaller and faster transistors to chips to maintain the pace of Moore’s Law, and as a consequence copper wiring is being drastically scaled and densities increased. Today advanced chips c... » read more

Atomic Layer Etch Finally Emerges
By Mark LaPedus - 15 May, 2014 - Comments: 1

The migration towards finFETs and other devices at the 20nm node and beyond will require a new array of chip-manufacturing technologies. Multiple patterning, hybrid metrology and newfangled interconnect schemes are just a few of the technologies required for future scaling. In addition, the industry also will require new techniques that can process structures at the atomic level. For example... » read more

The Bumpy Road To FinFETs
By Mark LaPedus - 15 May, 2014 - Comments: 2

The shift from planar transistors to finFETs is a major inflection point in the IC industry. FinFETs are expected to enable higher performance chips at lower voltages. And the next-generation transistor technology also could allow the industry to extend CMOS to the 10nm node and perhaps beyond. But as it turns out, finFET technology is also harder to master than previously thought. For exam... » read more

Cobalt To The Rescue
By Mark LaPedus - 13 May, 2014 - Comments: 0

A big concern for chipmakers is a key part of the manufacturing flow—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within a device. Interconnects, those tiny wiring schemes in devices, are becoming more compact at each node. This, in turn, is causing a degradation in performance and an increase in the dreaded resistance-capacitance (RC) ... » read more

Blog Review: April 30
By Ed Sperling - 30 Apr, 2014 - Comments: 0

Applied Materials’ Jeremy Read points to a looming problem for the Internet of Things—legacy fabs that will require software upgrades and advanced process control. Also needed: Sensors attached to thousands of machines for predictive maintenance. Foundries are now ready for production finFETs. Cadence's Richard Goering captures the buzz at last week’s TSMC Tech Symposium, where the ro... » read more

Executive Insight: CH Wu
By Ed Sperling - 21 Apr, 2014 - Comments: 0

Semiconductor Engineering sat down with CH Wu, president and CEO of Advantest Taiwan, to talk about business, politics, and his philosophy on what really motivates people. What follows are excerpts of that conversation. SE: Tell us a little about who you are and your background. Wu: I graduated from college with a degree in electrical engineering and started at Philips Electric, then moved ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 18 Apr, 2014 - Comments: 0

There is more evidence of a fab tool slowdown. In fact, ASML itself sounded the alarm during its earnings conference call this week. “ASML noted uncertainty regarding the timing of both the 16/14 nm finFET ramp at foundries (the company is seeing a delay from customers as the technology is still in development, in our view) and 3D NAND,” said Weston Twigg, an analyst from Pacific Crest Secu... » read more

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