Are Sustainability And Safety Gen Z’s Top Requirements In 2031?

By Frank Schirrmeister - 24 Feb, 2022 - Comments: 0

This blog is my 125th on the "Frankly Speaking" channel on SemiEngineering. A big thanks to Ed and his team for a great run and for putting up with my musings! I had started work-related blogging back in 2008, more company-specific, and some of these have since then vanished from the internet. Who would have thought! For this anniversary, I am looking forward ten years to 2031 and how generatio... » read more

Smart Glasses, Augmented Reality, And Time-of-Flight Imaging

By Edmund Neo - 20 Dec, 2021 - Comments: 0

By Edmund Neo and Rolf Weber Augmented reality (AR) is frequently discussed for providing new, exciting, vision-related products for consumer and industrial applications. One popular AR implementation uses AR glasses. While the global market for smart augmented reality glasses was only 255,600 units in 2020, market researchers predict robust growth and a volume of 8.8 million units by 2026 [... » read more

New Glasses Target Aspects Of AR & VR

By Paul McLellan - 11 Nov, 2021 - Comments: 0

Despite all the recent noise about the Metaverse (and Facebook changing its company name to Meta), I remain convinced that augmented reality (AR) is going to be more important than virtual reality (VR), at least in the medium term. For one thing, virtual reality headsets are large and expensive, at least today. I'm also not convinced that we all want to live in a virtual world like that...but I... » read more

In The Spotlight: What Is Responsible For The Surging Demand For CIS?

By Woo Young Han - 07 Sep, 2021 - Comments: 0

After TSMC announced plans to construct a new fab in Arizona, the Taiwan-based company disclosed that they are considering building new fabs in Japan and Germany. While the Arizona fab will focus on producing 5nm nodes using extreme ultraviolet lithography (EUV) technology, the new plant in Japan reportedly would focus on the 28nm node. This 28nm fab in Japan would be in addition to a 28nm fab ... » read more

MicroLEDs Moving From Lab to Fab

By Laura Peters - 22 Jul, 2021 - Comments: 1

Every disruptive technology has its "aha" moment — the time when everyone from engineers to investors realizes that, yes, this technology is the real deal and it won’t be scrapped on the R&D floor. For many, it was Samsung’s recent announcement of a 110-inch microLED TV that irrevocably put microLEDs on the map. The TV’s price is $155,000, but as with most consumer electronics th... » read more

Data Overload In The Data Center

By Ed Sperling - 25 Jan, 2021 - Comments: 0

Dealing with increasing volumes of data inside of data centers requires an understanding of architectures, the flow of data between memory and processors, bandwidth, cache coherency and new memory types and interfaces. Gary Ruggles, senior product marketing manager at Synopsys, talks about how these systems are being revamped to improve performance and reduce power. » read more

200mm Demand Surges

By Mark LaPedus - 17 Dec, 2020 - Comments: 1

A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Emerging Apps And Challenges For Packaging

By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Digital Immersion: The Next Step Towards The Future Of Mobile Devices And Connectivity

By Frank Schirrmeister - 28 May, 2020 - Comments: 0

In considering how far we’ve come with mobile devices just in the last two decades, it’s entertaining to think about the next ten years. When asking the new power users, Generation Z or the “digital natives,” a couple of key themes emerge, both for mobile devices, as well as for the networks they reside in. Some key advancements have been made this week with the announcement of Arm’s ... » read more

Spiking Neural Networks: Research Projects or Commercial Products?

By Bryon Moyer - 18 May, 2020 - Comments: 2

Spiking neural networks (SNNs) often are touted as a way to get close to the power efficiency of the brain, but there is widespread confusion about what exactly that means. In fact, there is disagreement about how the brain actually works. Some SNN implementations are less brain-like than others. Depending on whom you talk to, SNNs are either a long way away or close to commercialization. Th... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?