tag: architectures

Surprises At Hot Chips 2016
By Ed Sperling - 25 Aug, 2016 - Comments: 0

Who would have thought an Intel architect would be on stage talking about cutting pennies out of MCU prices? Or that Nvidia would be trumpeting an automotive SoC whose chief performance advantages come from the integration of ARM CPUs that can support up to eight virtual machines? Or that Samsung would be developing a quad-core mobile processor from scratch based on its own unique architecture?... » read more

Intelligent Flexible IoT Nodes
By Arm - 10 Feb, 2016 - Comments: 0

The media is buzzing with articles every week about the benefits of deploying IoT systems across various industries. Some forecasts mention the trillions of dollars that will be saved on a global scale from such deployments and the dramatic boost to those companies that make it all possible. At the heart of this global deployment is the IoT node, a sensor that converts the physical world to dig... » read more

Smaller, Faster, Cheaper
By Kinjal Dave - 12 Nov, 2015 - Comments: 0

Sometimes the most intriguing market growth comes in “unsexy” applications. Take the mobile market for example. Overall growth rates are cooling, as you’d expect with a maturing market. But in 2020, 1 billion smart phones are expected to ship in the entry-level category. This implies an 8% compounded annual growth rate, making entry mobile the most rapidly expanding mobile market segme... » read more

Power/Performance Bits: Oct. 27
By Jesse Allen - 27 Oct, 2015 - Comments: 0

Searching for energy-efficient architectures A workshop jointly funded by the Semiconductor Research Corporation (SRC) and National Science Foundation (NSF) sought out the key factors limiting progress in computing – particularly related to energy consumption – and novel research that could overcome these barriers. The report focuses on the most promising research directions in the ex... » read more

Is The 2.5D Supply Chain Ready?
By Ed Sperling - 28 Sep, 2015 - Comments: 0

A handful of big semiconductor companies began taking the wraps off 2.5D and fan-out packaging plans in the past couple of weeks, setting the stage for the first major shift away from Moore's Law in 50 years. Those moves coincide with reports of commercial [getkc id="82" kc_name="2.5D"] chips from chip assemblers and foundries that are now under development. There have been indications for... » read more

One-On-One: Dark Servers
By Katherine Derbyshire - 14 Apr, 2015 - Comments: 1

Professor Michael Taylor’s research group at UC San Diego is studying ways to exploit dark silicon to optimize circuit designs for energy efficiency. He spoke with Semiconductor Engineering about the post-Dennard scaling regime, energy efficiency from integrated circuits all the way up to data centers, and how the manufacturing side can help. What follows are excerpts of that conversation. To... » read more

What Ford Is Driving
By Ed Sperling - 04 Mar, 2015 - Comments: 0

Jim Buczkowski, director of electrical and electronics systems research and advanced engineering at Ford Motor Co., sat down with Semiconductor Engineering to talk about quality, security, architectures, packaging and automotive's unique constraints. What follows are excerpts of that conversation. SE: As more electronic content is included in automobiles, what kinds of issues are you dealing... » read more

Designing For Security
By Ernest Worthman - 08 Jan, 2015 - Comments: 0

Stacked die may improve performance and lower power, but the use of [getkc id="203" kc_name="through-silicon vias"] (TSVs) could add new security risks. As IC structures go, the vertical component of these chip packages is both a boon and a bust. Three-dimensional geometries allow for much less complexity in design by stacking two-dimensional dies and interconnecting them in the third dimens... » read more

Uncertainty Increases About What’s Next
By Ed Sperling - 24 Oct, 2013 - Comments: 0

Across the semiconductor industry, there is a lot of talk about what’s next. Lithography advances have stalled, NRE and mask costs are rising, and complexity is exploding. But unlike the 1 micron wall, which was supposed to be impenetrable, there is no single issue holding back progress. Instead, there are lots of them, most with pricey workarounds, but which together become more complicat... » read more

Layers Of Business And Tech Issues
By Ed Sperling - 15 Aug, 2013 - Comments: 0

Slice an onion in half and one onion pretty much looks like any other onion. Peel it back, layer by layer, and put it under a powerful microscope, and each layer suddenly looks very different. The same is true for semiconductors. To the outside world, a chip is a chip and an interconnect is an interconnect. Each one has different specs, but even the parts that make up those chips look remar... » read more

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