tag: Arkema

Chip Industry Technical Paper Roundup: June 25
By Linda Christensen - 25 Jun, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=236 /] More ReadingTechnical Paper Library home » read more

Plasma Etching : Challenges And Options Going Forward (UMD, IBM, Lam Research, Intel, Samsung et al.)
By Technical Paper Link - 18 Jun, 2024 - Comments: 0

A new technical paper titled "Future of plasma etching for microelectronics: Challenges and opportunities" was published by researchers from numerous academic institutions and companies, including University of Maryland, IBM, Arkema, UCLA, Lam Research, Intel Corporation, Samsung, Air Liquide, Sony, and many others. Abstract: "Plasma etching is an essential semiconductor manufacturing techn... » read more

Startup Funding: July 2021
By Jesse Allen - 04 Aug, 2021 - Comments: 0

The trend of big funding for Chinese autonomous driving companies continued in July, with three startups each drawing $100M or more for efforts in ADAS and computer vision for automotive. The month also saw one electric vehicle manufacturer get a massive boost as it begins production on its first models, while significant funding also went to a company that wants to recycle used up EV batteries... » read more

June’19 Startup Funding
By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

DSA Re-Enters Litho Picture
By Mark LaPedus - 15 Mar, 2018 - Comments: 1

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Mar, 2018 - Comments: 0

Chipmakers and OEMs After more than four years as chief executive of GlobalFoundries, Sanjay Jha will hand over the company’s top position to Thomas Caulfield, senior vice president and general manager at the foundry vendor. Caulfield, who joined GlobalFoundries in 2014, will become CEO. He has been running the company's fab in New York. "Jha intends to work closely with the company’s shar... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Mar, 2018 - Comments: 0

Fab tools Samsung Electronics has broken ground on a new extreme ultraviolet (EUV) lithography facility in Hwaseong, South Korea. The new EUV facility is expected to be completed within the second half of 2019 with production slated for 2020. The initial investment in the new EUV line is projected to reach $6 billion by 2020. Imec and Cadence Design Systems have collaborated on the develop... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

Manufacturing Bits: Feb. 25
By Mark LaPedus - 25 Feb, 2014 - Comments: 0

Intel joins DSA consortium Arkema, ASML, Intel and others have formed a new consortium in the emerging directed self-assembly (DSA) arena.The group, dubbed PLACYD, is a European funded consortium. Part of the Seventh Framework European Programme (FP7) and funded by ENIAC JU (European Technology Platform for Nanoelectronics), the project includes Arkema, CEA-Leti, STMicroelectronics, Intel,... » read more

DSA, Multi-beam Make Steady Progress
By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy