tag: Army Research Laboratory

Week In Review: Design, Low Power
By Susan Rambo - 19 May, 2023 - Comments: 0

Design Ansys has signed a definitive agreement to acquire EDA tool company Diakopto. Diakopto specializes in software tools that find the cause of layout parasitics. Its products are ParagonX, for analyzing and debugging IC designs and layout parasitics, and EM/IR analysis/verification tool PrimeX. The deal is expected to close in the second quarter of 2023. SEMI’s FlexTech community issu... » read more

Manufacturing Bits: Feb. 15
By Mark LaPedus - 15 Feb, 2022 - Comments: 0

Strong plastics The Massachusetts Institute of Technology has developed a new material that is stronger than steel but is light as plastic. The new material, which can be made in large quantities, involves a two-dimensional polymer that self-assembles into sheets. The material’s Young modulus—or a measure of how much force it takes to deform a material—is between four and six times gr... » read more

Manufacturing Bits: Aug. 9
By Mark LaPedus - 09 Aug, 2021 - Comments: 1

Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

Design Comparison of SiC MOSFETs for Linear-Mode Operation
By Technical Paper Link - 02 Oct, 2019 - Comments: 0

Source: US Army Research Lab Authors: Heather O'Brien, Damian Urciuoli, Aderinto Ogunniyi, Brett Hull August 2019 "Abstract: Silicon carbide metal-oxide semiconductor field-effect transistors (MOSFETs) were designed and fabricated for linear-mode applications. The MOSFETs have a chip area of 3.3 ? 3.3 mm and a voltage-blocking rating up to 1200 V. The device design parameters, such as chan... » read more

System Bits: Oct. 1
By Jeff Dorsch - 01 Oct, 2019 - Comments: 0

Jumping the gap in microchips A quasi-particle that travels along the interface of a metal and dielectric material may be the solution to problems caused by shrinking electronic components, according to an international team of engineers. "Microelectronic chips are ubiquitous today," said Akhlesh Lakhtakia, Evan Pugh University Professor and Charles Godfrey Binder Professor of Engineering S... » read more

System Bits: May 21
By Jeff Dorsch - 21 May, 2019 - Comments: 0

Washable, wearable energy devices for clothing Researchers at the University of Cambridge collaborated with colleagues at China’s Jiangnan University to develop wearable electronic components that could be woven into fabrics for clothing, suitable for energy conversion, flexible circuits, health-care monitoring, and other applications. Graphene and other materials can be directly incorpor... » read more

Power/Performance Bits: Feb. 19
By Jesse Allen - 19 Feb, 2019 - Comments: 0

Flexible energy harvesting rectenna Researchers from MIT, Universidad Politécnica de Madrid, University Carlos III of Madrid, Boston University, University of Southern California, and the Army Research Laboratory created a flexible rectenna capable of converting energy from Wi-Fi signals into electricity to power small devices and sensors. The device uses a flexible RF antenna to capture e... » read more

Manufacturing Bits: Jan. 31
By Mark LaPedus - 31 Jan, 2017 - Comments: 0

Fiber-imprint patterning The École polytechnique fédérale de Lausanne (EPFL)--a research institute/university in Lausanne, Switzerland--has put a new twist in nano-imprint patterning technology. It has devised a way to imprint tiny or nano-metric patterns on hollow polymer fiber. Using a technique called thermal drawing, tiny patterns can be printed on both the inside and the outside of ... » read more

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