tag: Arteris IP

Waiting For Chiplet Interfaces
By Brian Bailey - 13 Jun, 2019 - Comments: 0

There aren't many success stories related to chiplets today for a very simple reason—there are few standard interfaces defined for how to connect them. In fact, the only way to use them is to control both sides of the interface with a proprietary interface and protocol. The one exception is the definition of HBM2, which enables large quantities of third-party DRAM to be connected to a logi... » read more

Machine Learning Drives High-Level Synthesis Boom
By Kevin Fogarty - 06 Jun, 2019 - Comments: 0

High-level synthesis (HLS) is experiencing a new wave of popularity, driven by its ability to handle machine-learning matrices and iterative design efforts. The obvious advantage of HLS is the boost in productivity designers get from working in C, C++ and other high-level languages rather than RTL. The ability to design a layout that should work, and then easily modify it to test other confi... » read more

Accelerating Endpoint Inferencing
By Kevin Fogarty - 06 Jun, 2019 - Comments: 0

Chipmakers are getting ready to debut inference chips for endpoint devices, even though the rest of the machine-learning ecosystem has yet to be established. Whatever infrastructure does exist today is mostly in the cloud, on edge-computing gateways, or in company-specific data centers, which most companies continue to use. For example, Tesla has its own data center. So do most major carmake... » read more

Using Synopsys Z01X To Accelerate The Fault Injection Campaign Of A Fully Configurable IP
By Arteris - 05 Jun, 2019 - Comments: 0

By Arteris IP Alexis Boutillier, Corporate Application Manager, Safety Manager, and Mohan Krishnareddy, Solution Engineer, at the Synopsys Users Group (SNUG), March 2018, Santa Clara, CA. Principles and real-world practices of ISO 26262 for semiconductor design teams. After providing an overview of how functional safety affects management, development, and supporting processes, the paper exp... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 May, 2019 - Comments: 0

M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 17 May, 2019 - Comments: 0

Internet of Things Verizon Communications launched its nationwide narrowband Internet of Things network, saying it covers more than 92% of the U.S. population. “There is a whole universe of smart solutions needing scalable and affordable connections,” Jeffrey Dietel, senior vice president of business marketing and products, said in a statement. “By launching our NB-IoT network, Verizon i... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 May, 2019 - Comments: 0

Tools & IP Cadence introduced the Tensilica Vision Q7 DSP, which provides up to 1.82 TOPS and is specifically optimized for simultaneous localization and mapping (SLAM). The DSP has a very long instruction word (VLIW) SIMD architecture, an enhanced instruction set supporting 8/16/32-bit data types and optional VFPU support for single and half precision, and a number of iDMA enhancements in... » read more

Chiplet Momentum Builds, Despite Tradeoffs
By Brian Bailey - 13 May, 2019 - Comments: 0

Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 10 May, 2019 - Comments: 0

Internet of Things Microsoft this week introduced IoT Plug and Play, a no-code toolkit for connecting Internet of Things devices to the cloud. The company touts it as a new modeling language to pump up the capabilities of IoT devices through the Microsoft Azure cloud service. The Azure IoT Device Catalog lists devices that support IoT Plug and Play, such as the STMicroelectronics SensorTile.bo... » read more

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