tag: Arteris

Where Is 2.5D?
By Ed Sperling - 19 Dec, 2013 - Comments: 3

After nearly five years of concentrated research, development, test chips and characterization, 2.5D remains a possibility for many companies but a reality for very few. So what’s taking so long and why hasn’t all of this hype turned into production runs instead of test chips? Semiconductor Engineering spent the past two months interviewing dozens of people on this subject, from chipmakers ... » read more

Industry Restructures Around Cost
By Ed Sperling - 19 Dec, 2013 - Comments: 1

Talk to any semiconductor executive these days about what’s next for their company and you’ll probably encounter the same perspective—cost will drive future design decisions. Dig a little further, however, and you’ll find no consistent strategy for reducing that cost. While the industry has three very viable solutions for improving the power and performance characteristics of SoCs—... » read more

Industry-Shaking Changes Ahead
By Kurt Shuler - 19 Dec, 2013 - Comments: 1

I’ve been closely following the increasing power of system OEMs (such as Apple, Google, Facebook and Microsoft) over players in the semiconductor industry with an eye toward understanding how this will affect others in the semi value chain. However, I haven’t paid as much attention to the root causes of why these changes are occurring. McKinsey & Company has provided our industry food f... » read more

The Week In Review: System-Level Design
By Ed Sperling - 13 Dec, 2013 - Comments: 0

A widely quoted report by Bloomberg said ARM might benefit from a major deal with Google, which is considering using ARM cores in its own processor designs. It's impossible to tell at this point whether Google actually will go through with developing its own chips, a move that would have monumental ramifications in multiple areas. For one thing it would give ARM a major entry into the data cent... » read more

What Just Happened?
By Brian Fuller - 12 Dec, 2013 - Comments: 0

Boy that went by fast. One minute, I’m waking up a little groggy on New Year’s Day, wondering whether the silicon industry is ever going to rebound. The next minute, it’s today and the industry had a good year, and is, in many ways, a completely different animal than it was 12 months ago. Innovation is evolutionary, sure. But if you really think about 2013, you can make an argument tha... » read more

Blog Review: Nov. 27
By Ed Sperling - 27 Nov, 2013 - Comments: 0

Synopsys’ Brent Gregory is looking at real-world experiments to figure out which EDA software is better. Make sure to check out his stats. Cadence’s Brian Fuller interviews two Samsung engineers in a video about the image technology in smart phone cameras and just how far it’s progressed. Hint: Don’t forget to charge your phone on your next vacation. Mentor’s Colin Walls points ... » read more

Gartner Recommends Network-on-Chip (NoC) Technology For SoC Design
By Kurt Shuler - 21 Nov, 2013 - Comments: 0

In their latest Hype Cycle for Semiconductors and Electronics Technologies report, Gartner Research has taken the bold step of recommending that all enterprises involved in advanced SoC design should seriously evaluate network-on-chip (NoC) technology based interconnect fabric IP: “The technology has continued to receive a good amount of publicity along with continued adoption by leading S... » read more

Blog Review: Nov. 20
By Ed Sperling - 20 Nov, 2013 - Comments: 0

Can you really heat your home office with just four candles? It all depends on where you put those candles, as Mentor’s Robin Bornoff shows in part one of this series. And make sure you check out the video, particularly if you’ve had a tough day. Synopsys’ Karen Bartleson interviews ST’s Oleg Logvinov on camera about the IoT, which may be the biggest change since the Industrial Revol... » read more

The Week in Review: System-Level Design
By Ed Sperling - 15 Nov, 2013 - Comments: 0

Cadence unveiled its next-gen power signoff tool, this one based upon parallel execution across multiple processors. The result is 10x speed improvement, according to the company. The signoff solution already is certified for TSMC’s 16nm finFET process for IR drop analysis and EM rule compliance, two of the big concerns with finFETs. Synopsys teamed up with CEVA to improve PPA for CEVA’s... » read more

The Week In Review: System-Level Design
By Ed Sperling - 01 Nov, 2013 - Comments: 0

Qualcomm bought some of Arteris’ IP assets and the bulk of its French design team, but Arteris remains a viable company with a NoC product, customers, and an infrastructure. ARM released a study, in conjunction with the Economist Intelligence Unit, that shows 75% of global business leaders are actively researching opportunities on the Internet of Things. The report says the five barriers f... » read more

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