Software-Defined Hardware Gains Ground — Again


The traditional approach of running generic software on x86-based CPUs is running out of steam for many applications due to the slowdown of Moore’s Law and the concurrent exponential growth in software application complexity and scale. In this environment, the software and hardware are disparate due the dominance of the x86 architecture. “The need for and advent of the hardware accelerat... » read more

Design For Airborne Electronics


The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

Context-Aware Debug


Moses Satyasekaran, product manager at Mentor, a Siemens Business, examines the growing complexity of debug, which now includes software, power intent and integration, multiple clocking and reset domains, and much more, where the limitations are for debug, and how automotive, functional safety and mixed signal affect the overall process. » read more

Using FPGAs For AI


Artificial intelligence (AI) and machine learning (ML) are progressing at a rate that is outstripping Moore's Law. In fact, they now are evolving faster than silicon can be designed. The industry is looking at all possibilities to provide devices that have the necessary accuracy and performance, as well as a power budget that can be sustained. FPGAs are promising, but they also have some sig... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Less Margin, More Respins, And New Markets


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx; Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

ML, Edge Drive IP To Outperform Broader Chip Market


The market for third-party semiconductor IP is surging, spurred by the need for more specific capabilities across a wide variety of markets. While the IP industry is not immune to steep market declines in semiconductor industry, it does have more built-in resilience than other parts of the industry. Case in point: The top 15 semiconductor suppliers were hit with an 18% decline in 2019 first-... » read more

CEO Outlook: Rising Costs, Chiplets, And A Trade War


Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Week in Review: IoT, Security, Auto


Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

CEO Outlook: It Gets Much Harder From Here


Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

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