tag: ASICs

The Data Deluge
By Ed Sperling - 23 Jan, 2019 - Comments: 0

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to discuss the intersection of big data and technology, from the data center to the edge and vertical markets such as automotive. What follows are excerpts of that conversation. SE: What are the biggest changes you've seen over the past year? Tan: We are moving quickly toward data-driven economics. There... » read more

Making IP Friendlier
By Brian Bailey - 27 Dec, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss IP tracking and management with Ranjit Adhikary, vice president of marketing for ClioSoft; Jim Bruister, director digital systems (since retired) at Silvaco; Marc Greenberg, product marketing group director at Cadence; and Kelvin Low, vice president of marketing at Arm. What follows are excerpts from that conversation. Part one can be found here. ... » read more

Will AI Drive Scaling Forward?
By Ed Sperling - 17 Dec, 2018 - Comments: 0

The almost ubiquitous rollout of AI and its offshoots—machine learning, deep learning, neural nets of all types—will require significantly more processing power as the amount of data that needs to be processed continues to grow by orders of magnitude. What isn't clear yet is how that will affect semiconductor manufacturing or how quickly that might happen. AI is more than the latest buz... » read more

Fab Equipment Challenges For 2019
By Mark LaPedus - 17 Dec, 2018 - Comments: 0

After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND ... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Getting Down To Business On Chiplets
By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 16 Nov, 2018 - Comments: 0

Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

From Physics To Applications
By Ed Sperling - 25 Oct, 2018 - Comments: 0

Jack Harding, president and CEO of eSilicon, sat down with Semiconductor Engineering to talk about the shift toward AI and advanced packaging, and the growing opportunities at 7nm at a time when Moore's Law has begun slowing down. What follows are excerpts of that conversation. SE: Over the past year, the industry has changed its focus from shrinking features and consolidation to all sorts o... » read more

Reconfigurable eFPGA For Aerospace Applications
By Geoff Tate - 12 Oct, 2018 - Comments: 0

Market research reports indicate about 10% of all dollar revenue of FPGA chips is for use in aerospace applications, and DARPA/DoD reports indicate about one-third of all dollar volume of ICs purchased by U.S. aerospace are FPGAs. FPGAs clearly are very important for aerospace applications because of a combination of short development time and the long mission life of many aerospace applica... » read more

AI, ML Chip Choices
By Ed Sperling - 07 Aug, 2018 - Comments: 0

Flex Logix’s Cheng Wang talks about which types of chips work best for neural networks, AI and machine learning. https://youtu.be/k7OdP7B10o8 » read more

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