tag: ASML

High-NA EUVL: the next major step in lithography
By Technical Paper Link - 05 Oct, 2021 - Comments: 0

"In the course of 2025, we expect to see the introduction of the first high-NA extreme ultraviolet (EUV) lithography equipment in high-volume manufacturing environments. These next-generation lithography systems will be key to advance Moore’s Law towards the logic 2nm technology generation and beyond. In this article, imec scientists and engineers involved in preparing this major engine... » read more

Manufacturing Bits: Oct. 5
By Mark LaPedus - 05 Oct, 2021 - Comments: 0

EUV lithography storage ring At the recent SPIE Photomask Technology + EUV Lithography conference, Japan’s High Energy Accelerator Research Organization (KEK) presented a paper on its latest efforts to develop a free-electron laser (FEL) storage ring source power unit for extreme ultraviolet (EUV) lithography. KEK has demonstrated a proof-of-concept EUV-FEL, which has been in R&D. EUV-FEL... » read more

Inside Intel’s Ambitious Roadmap
By Mark LaPedus and Ed Sperling - 23 Aug, 2021 - Comments: 2

Ann Kelleher, senior vice president and general manager of Technology Development at Intel, sat down with Semiconductor Engineering to talk about the company’s new logic roadmap, as well as lithography, packaging, and process technology. What follows are excerpts of that discussion. SE: Intel recently disclosed its new logic roadmap. Beyond Intel 3, the company is working on Intel 20A. Wit... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Jul, 2021 - Comments: 0

Chipmakers and OEMs The industry is still wondering if Intel will buy GlobalFoundries (GF). In the meantime, GF has announced a fab expansion plan in upstate New York. These plans include immediate investments at its existing Fab 8 facility as well as construction of a new fab on the same campus. That will double the capacity at the site. Intel has reported its second-quarter 2021 financial... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Jun, 2021 - Comments: 0

Fab tools TEL plans to ship its leading-edge coater/developer system to the joint Imec-ASML research lab, which is working on high-NA extreme ultraviolet (EUV) lithography. The equipment will be integrated with the EXE:5000, ASML’s next-generation high-NA EUV lithography system. The 0.55 numerical aperture (NA) tool is slated to be operational in 2023. Today's EUV is in production, but there... » read more

Finding, Predicting EUV Stochastic Defects
By Mark LaPedus - 17 Jun, 2021 - Comments: 0

Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect detection technology involves various tradeoffs. But it’s imperative to use one or more of them in the fab. Ultimately, these so-called stochastic-induced defects caused by EUV can impact the perf... » read more

Demand, Lead Times Soar For 300mm Equipment
By Mark LaPedus - 20 May, 2021 - Comments: 0

A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Apr, 2021 - Comments: 0

Chipmakers and OEMs Several foundry vendors are building new fabs. The memory vendors, such as Samsung and SK Hynix, are also building new capacity. In another example, Taiwan DRAM supplier Nanya Technology plans to construct a new 300mm fab in the Taishan Nanlin Technology Park in New Taipei City. The plant will produce DRAMs with Nanya’s in-house developed 10nm-class process technologies a... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

EUV Pellicles Finally Ready
By Mark LaPedus - 22 Mar, 2021 - Comments: 0

After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

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