NanoResolution MRS Sensor Delivers Fast, Precise 3D Inspection And Measurement For Advanced Semiconductor Packaging Applications


The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

Inspection And Metrology Of Micro LED Technology


Micro LEDs developed using Rohinni’s technology can be deployed in consumer electronics devices, automotive applications and outdoor signage, among other applications. The disruptive technology enables products that are brighter, thinner, lighter and more dynamic that those currently on the market, with lower power consumption than LCD or OLED. Rohinni needed an inspection and metrology so... » read more

Test In New Frontiers: Flexible Circuits


Test is becoming increasingly complicated as new technologies such as flexible electronics begin playing mission-critical roles in applications where electronics have little or no history. Although flexible circuitry has been around for while, testing needs to catch up as these circuits are deployed across a variety of markets where conditions may be extreme. In many cases, sensors for monit... » read more

Addressing High Precision Automated Optical Inspection Challenges With 3D Technology


Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition which is more time consuming. Precise 3D image re... » read more