Big Changes Ahead For Inside Auto Cabins


The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

Scaling Processor Performance And Safety To Meet Requirements For Next-Generation Safety-Critical Automotive Designs


This white paper proposes a state-of-the-art processor architecture targeting automotive safety systems that meets the requirements of such active safety systems delivering the required processing performance, providing the highest automotive safety integrity level (ASIL) while also significantly contributing to a reduction in overall cost of the systems through the use of artificial neural net... » read more

Using Manufacturing Data To Boost Reliability


As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

Securing Connected And Autonomous Vehicles


Vehicles are on track to become highly sophisticated Internet of Things (IoT) devices. With the added functionality that connects vehicles to other vehicles, the infrastructure, and even pedestrians, the opportunity for hacking expands. Challenges like complexity and the burden of legacy systems further complicate the situation. The future of connected and autonomous vehicles (CAV) demands leve... » read more

Why It’s So Difficult — And Costly — To Secure Chips


Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Meeting Processor Performance And Safety Requirements For New ADAS & Autonomous Vehicle Systems


By Fergus Casey and Srini Krishnaswami Innovation in today’s automotive industry is accelerating as companies race to be the market leader in safety and autonomous vehicles. With vehicle control moving from humans to the vehicles’ active safety systems, more sensors – cameras, radar, lidar, etc. – are being added to automotive systems. More sensors require more computational performa... » read more

Effectively Addressing The Challenge Of Securing Connected And Autonomous Vehicles


Vehicles are becoming the most sophisticated connected objects in the ‘Internet of Things’. As vehicles integrate functionality that will enable a fully autonomous future, the attack surface grows substantially. Combined with remote connectivity at multiple points, the clock is ticking in a race to improve cybersecurity in all types of vehicles to ensure that all stakeholders, but particula... » read more

Product Lifecycle Management For Semiconductors


Product lifecycle management (PLM) and the semiconductor industry have always been separate, but pressure is growing to integrate them. Automotive, IIoT, medical, and other industries see that as the only way to manage many aspects of their business, and as it stands, semiconductors are a large black box in that methodology. The technology space is driven by a mix of top down and bottom-up p... » read more

Achieving Success In Automotive Leadframe Packages


The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest advanced, laminate-based packages using flip chip interconnect as well as the venerable leadframe packages using wirebond interconnect. The automotive market consumes micro-electromechanical systems... » read more

China Accelerates Foundry, Power Semi Efforts


China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

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