tag: automotive

ISO 26262 – Law Or Framework?
By Kurt Shuler - 09 Aug, 2021 - Comments: 0

The ISO 26262 standard is a weighty series of documents that many believe has all the force of law or regulation; however, it is not a dictate. It is an agreement on best practices for participants in the vehicle value chain to follow to ensure safety as far as the industry understands it today. There is no monetary fine if the standard is not followed, though it will be difficult to sell autom... » read more

Automotive Lidar Technologies Battle It Out
By Bryon Moyer - 05 Aug, 2021 - Comments: 1

Lidar is likely to be added to the list of sensors that future cars will use to help with navigation and safety, but most likely it won't be the large rotating mirror assembly on the top of vehicles. Newer solid-state radar technologies are being researched and developed, although it’s not yet clear which of these will win. “The benefits of lidar technology are well known dating back to ... » read more

Protecting Automotive SoCs Starts With Secure IP
By Dana Neustadter - 05 Aug, 2021 - Comments: 0

The automotive industry is undergoing a significant transformation. Cars are becoming more sophisticated and valuable with increased connectivity and capabilities to provide a better user experience. They are also collecting and transmitting more and more sensitive data and thus are becoming very attractive targets for attacks. Cybercrime in the automotive industry is growing rapidly. How bad i... » read more

Auto Displays: Bigger, Brighter, More Numerous
By Ann Mutschler - 05 Aug, 2021 - Comments: 0

Displays are rapidly becoming more critical to the central brains in automobiles, accelerating the adoption and evolution of this technology to handle multiple types of audio, visual, and other data traffic coming into and flowing throughout the vehicle. These changes are having a broad impact on the entire design-through-manufacturing flow for display chip architectures. In the past, these ... » read more

Changes In Auto Architectures
By Ed Sperling - 04 Aug, 2021 - Comments: 0

Automotive architectures are changing from a driver-centric model to one where technology supplements and in some cases replaces the driver. Hans Adlkofer, senior vice president and head of the Automotive Systems Group at Infineon, looks at the different levels of automation in a vehicle, what’s involved in the shift from domain to zonal architectures, why a mix of processors will be required... » read more

Beyond Bug Hunting: Verification Coverage From Safety To Certification
By OneSpin Solutions - 04 Aug, 2021 - Comments: 0

Understanding verification coverage is critical for meeting IC integrity standards and goes well beyond detecting bugs in the design. Without proper verification coverage metrics, meeting strict safety standards and certification may not be achievable. Precise metrics indicate where there are gaps in verification and provide a clear view of the progress being made in the verification effort. Co... » read more

Designing Chips In A ‘Lawless’ Industry
By Ed Sperling - 02 Aug, 2021 - Comments: 2

The guideposts for designing chips are disappearing or becoming less relevant. While engineers today have many more options for customizing a design, they have little direction about what works best for specific applications or what the return on investment will be for those efforts. For chip architects, this is proving to be an embarrassment of riches. However, that design freedom comes wit... » read more

MEMS: New Materials, Markets And Packaging
By Ed Sperling - 28 Jul, 2021 - Comments: 1

Semiconductor Engineering sat down to talk about future developments and challenges for microelectromechanical systems (MEMS) with Gerold Schropfer, director of MEMS products and European operations in Lam Research's Computational Products group, and Michelle Bourke, senior director of strategic marketing for Lam's Customer Support Business Group. What follows are excerpts of that conversation.... » read more

Packaging Technology Needs Of Automotive Radar Sensors Chips
By Ken Hsiao - 22 Jul, 2021 - Comments: 0

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated circuit and a wide range of packaging technologies. Let’s look a bit further into the development of automotive radar sensor chips and the packaging technologies being used as solutions for this... » read more

Will An Adhesion Promoter Prevent Delamination In Power Semiconductor Packages?
By Amkor - 21 Jul, 2021 - Comments: 0

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor pack... » read more

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