Week In Review: Manufacturing, Test

By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week In Review: Design, Low Power

By Jesse Allen - 24 May, 2019 - Comments: 0

M&A Marvell will acquire Avera Semiconductor, the ASIC business of GlobalFoundries, for $650 million in cash at closing plus an additional $90 million in cash if certain business conditions are satisfied within the next 15 months. The agreements include transfer of Avera's revenue base, strategic design wins with infrastructure OEMs, and a new long-term wafer supply agreement between Globa... » read more

Week In Review: Design, Low Power

By Susan Rambo - 15 Feb, 2019 - Comments: 0

Tools & IP Engineering simulation company ANSYS says thanks to new features in its ANSYS Twin Builder, product developers may be able save money in warranty and operational costs. The Twin Builder creates a digital twin of a systems in the field, enabling a convenient way to monitor and maintain systems remotely. The latest release adds predictive maintenance features for digital-twin runt... » read more

What’s the Right Path For Scaling?

By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

The Week In Review: Design

By Jesse Allen - 02 Nov, 2018 - Comments: 0

M&A GlobalFoundries formed Avera Semiconductor, a wholly-owned subsidiary focused on custom ASIC designs. While Avera will use its relationship with GF for 14/12nm and more mature technologies, it has a foundry partnership lined up for 7nm. The new company's IP portfolio includes high-speed SerDes, high-performance embedded TCAMs, ARM cores and performance and density-optimized embedded SR... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Avera Semiconductor

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Week In Review: Design, Low Power

What’s the Right Path For Scaling?

The Week In Review: Design

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Knowledge Centers
Entities, people and technologies explored