Week In Review: Design, Low Power


Tools, Cloud, IP Valtrix Systems updated its STING design verification tool for RISC-V based CPU and SoC implementations. Version 1.9.0 adds support to verify recent changes to the RISC-V user and privilege specifications, including draft versions of the vector and bit manipulation standard extensions. Preliminary support for the draft version of the RISC-V hypervisor extension has also been a... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Austin, Texas-based automotive startup Uhnder raised $45 million in Series C funding for its digital radar-on-chip. Telechips, a fabless semiconductor company that works on automotive SoCs, is using Arm’s IP to design its Dolphin5 SoC for ADAS (advanced drive assistance systems) and digital cockpits with in-vehicle infotainment (IVI). Dolphin5 will include the Arm’s Mali-G78A... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive/Mobility China may act to rein in its EV market, according a story in Nikkei Asia. The National Development and Reform Commission in China asked for investment and production plans for EV projects over the last five years, which is signal to some industry insiders that the government may regulate some of the industry. Softbank and carmaker Subaru completed a test that used a 5G n... » read more

Security At The Edge


Semiconductor Engineering sat down to discuss security at the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus, Kris Ardis, executive director at Maxim Integrated; and Steve Roddy, vice president of Arm's Products Learning Group. What follows are excerpts of that conversation. To view part one of this discussion, click here. Part two i... » read more

The Four Pillars Of Hyperscale Computing


In his keynote at CadenceLIVE Americas 2020, Facebook’s Vijay Rao, director, Technology and Strategy, described the four core elements the team considers when designing their data centers—compute, storage, memory, and networking. Wait a minute. Facebook? How did we get here? Wasn’t EDA supposed to be focused on chip design? As indicated in a previous blog, electronic value chains are defi... » read more

The Next Leap


Some interesting new technologies are about to go on display. Chipmakers and systems companies have been working on quantum computing, photonics, and specialized AI processors, for the past several years, and those efforts are beginning to gain momentum. The goal is no longer a doubling of performance and power. It's now orders of magnitude improvement, and next week's Hot Chips conference i... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

DAC 2020 Day One


DAC 2020 is like no other Design Automation Conference. It is virtual for this year — and hopefully only this year. The COVID pandemic has proven that face-to-face meetings and conferences are invaluable for many reasons. But with none of the distractions of a traditional conference, focusing on the content was easy. And because the sessions have been pre-recorded, the speakers for each se... » read more

Week In Review: Auto, Security, Pervasive Computing


Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Maximizing Value Post-Moore’s Law


When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

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