Embracing the Challenges Of Cybersecurity In Automotive Applications

By Gulam Ashrafi - 01 Dec, 2022 - Comments: 1

The growth of electronics in cars is exposing a new vector for cyberattacks on car owners and automotive companies’ reputations. The potential human cost of an attack on the car’s electronics is driving urgency in the adoption of cybersecurity-aware practices, from OEMs and Tier 1s to every component supplier in the automotive industry. The standard “ISO/SAE 21434:2021 Road vehicles — C... » read more

3 Safety Standards For Auto Electronics

By Ed Sperling - 13 Jan, 2020 - Comments: 0

Kurt Shuler, vice president of marketing at Arteris IP, drills down into the three main safety standards, ISO 26262, SOTIF (Safety of the Intended Function) and UL 4600, what each one covers, what the intent is behind them, and what this means for companies developing technology for future vehicles. » read more

Reduce, Reuse, Recycle

By Neil Hand - 25 Jul, 2013 - Comments: 0

By Neil Hand I’m not talking about how to make more environmentally friendly products, because let’s face it, the gadgets we love are monsters when it comes to environmental impact. I’m referring to the ideals of environmentalism and how those can be applied in a system-design context. Reduce, Reuse, Recycle This is the mantra you see everywhere and it maps very well into the system ... » read more

Strategies To Prevent IC Failures In Volume Production

By Various Writers - 25 Jul, 2013 - Comments: 0

When IC devices are produced and shipped to end customers, it is important that they will function as specified in the application environment. This paper outlines strategies and practices used to statistically sample, and predict how a device will operate over time. The practices outlined are believed to be best in class techniques for a successful product launch. These strategies most likely ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: best practices

Embracing the Challenges Of Cybersecurity In Automotive Applications

3 Safety Standards For Auto Electronics

Reduce, Reuse, Recycle

Strategies To Prevent IC Failures In Volume Production