Why so many standards and what does each one require?
Kurt Shuler, vice president of marketing at Arteris IP, drills down into the three main safety standards, ISO 26262, SOTIF (Safety of the Intended Function) and UL 4600, what each one covers, what the intent is behind them, and what this means for companies developing technology for future vehicles.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Increased transistor density and utilization are creating memory performance issues.
Lots of unknowns will persist for decades across multiple market segments.
FPGAs, CPUs, and equipment receive funding in China; 98 startups raise over $2 billion.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.
Some of the less common considerations for assessing the suitability of a system for high-performance workloads.
Manufacturing 3D structures will require atomic-level control of what’s removed and what stays on a wafer.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Disaggregation and the wind-down of Moore’s Law have changed everything.
Leave a Reply