tag: aging

Challenges With Chiplets And Power Delivery
By Ed Sperling - 15 Apr, 2024 - Comments: 0

Chiplets hold the potential to deliver the same PPA benefits as an SoC, but with many more features and options that are possible on a reticle-constrained die. If chiplets live up to the hype, they will deliver what is essentially mass customization, democratizing and speeding the delivery of complex chips across a broad array of markets. Today, the focus has been on die-to-die interfaces, but ... » read more

Silent Data Corruption Considerations For Advanced Node Designs
By Jyotika Athavale - 12 Mar, 2024 - Comments: 0

Ensuring reliability, availability, and serviceability (RAS) has long been an important consideration for many types of electronic systems, with major implications for chip design. Clearly, military hardware must be very reliable, and servers and automotive systems are also expected to be available constantly. Some amount of failure is inevitable, so being able to repair, avoid, or mitigate fau... » read more

Reducing Power In Data Centers
By Ed Sperling - 16 Jan, 2024 - Comments: 0

The rollout of generative AI, coupled with more data in general, is requiring data centers to run servers harder and longer. That, in turn, is generating more heat and accelerating aging, and to ensure these systems continue working over their projected lifetimes, chipmakers are building extra margin into chips. That increases the amount of energy required to run and cool them, and it can short... » read more

In-Product BTI Aging Sensor For Reliability Screening And Early Detection Of Material At Risk
By PDF Solutions - 09 Jan, 2024 - Comments: 0

We have developed a new reliability monitoring suite, within a proprietary IP block that we call a CV Core, with aging sensors embedded in the product layout and testable through the product I / O interface. We illustrate the application of the sensor suite with an example of the PMOS NBTI monitor, testable at the wafer level during product electrical wafer sort (EWS), as well after packaging a... » read more

Reliability On The Rise In IC Design
By Andre Lange - 14 Sep, 2023 - Comments: 0

Reliability has been an important factor in the semiconductor industry for decades. A closer look reveals three main priorities: In the area of technology development and optimization, the microscopic mechanisms that lead to degradation must be identified and understood before they can be fixed. Microanalytical methods are used here as well as TCAD simulations. If it’s not possible to... » read more

Pinpointing Timing Delays in Complex SoCs
By Anne Meixner - 11 Jul, 2023 - Comments: 0

Telemetry circuits are becoming a necessity in complex heterogeneous chips and packages to show how these devices are behaving post-production, but fusing together relevant data to identify the sources of problems adds its own set of challenges. In the past, engineering teams could build margin into chips to offset any type of variation. But at advanced nodes and in advanced packages, tolera... » read more

Search Based Method For Identifying Aging Model Parameters
By Technical Paper Link - 24 Jun, 2023 - Comments: 0

A technical paper titled “Leveraging Public Information to Fit a Compact Hot Carrier Injection Model to a Target Technology” was published by researchers at University of Victoria. Abstract: "The design of countermeasures against integrated circuit counterfeit recycling requires the ability to simulate aging in CMOS devices. Electronic design automation tools commonly provide this ability... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Taming Corner Explosion In Complex Chips
By Brian Bailey - 23 Feb, 2023 - Comments: 0

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Safety, Security, And Reliability Of AI In Autos
By Ed Sperling - 22 Feb, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about security, aging, and safety in automotive AI systems, with Geoff Tate, CEO of Flex Logix; Veerbhan Kheterpal, CEO of Quadric; Steve Teig, CEO of Perceive; and Kurt Busch, CEO of Syntiant. What follows are excerpts of that conversation, which was held in front of a live audience at DesignCon. Part one of this discussion is he... » read more

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