Packaging Challenges For 2018


The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Metric Pitch BGA And Micro BGA Routing Solutions


The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note: the “metric” dimensions are the ruling numbers. To solve the metric pitch BGA dilemma, one should have a basic understanding of the metric feature sizes for: BGA Ball Sizes and BGA Land Pattern Pad Construction BGA Via Anatomy Trace/Space Trace and Via Routi... » read more