tag: BGA

Establishing Connectivity Between Die and BGA
By Tyler Lockman - 03 Sep, 2020 - Comments: 0

The BGA component serves the primary role of redistributing the signals from the die it protects to an interface pattern (the BGA’s balls) compatible with the host PCB it mounts on. As a result, many IC package designs are among those who do not use a front-end schematic. Even if you have a schematic, you may find yourself making logic swaps in the layout where the additional context of the r... » read more

EDA On Board With New Package Options
By Ann Mutschler - 22 Jul, 2020 - Comments: 2

A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

Using Digital Image Correlation To Determine BGA Warpage
By Craig Hillman - 16 Jan, 2020 - Comments: 0

Digital image correlation (DIC) is a non-contact, full-field displacement, optical measurement technique. It is often used in the following applications: Material characterization Coefficient of thermal expansion (CTE) Glass transition temperature Young’s modulus Poisson’s ratio Sample testing for fatigue and failure In situ monitoring of displacements and str... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Design For Advanced Packaging
By Brian Bailey - 08 Nov, 2018 - Comments: 0

Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

Packaging Challenges For 2018
By Mark LaPedus - 08 Jan, 2018 - Comments: 0

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test ([getkc id="83" kc_name="OSAT"]) industry, which provides third-party packaging and test services, has been consolidating for some time. So while sales rising, the number of companies is falling. In late 2017, for example, [getentity id="2... » read more

Metric Pitch BGA And Micro BGA Routing Solutions
By Various Writers - 08 Feb, 2011 - Comments: 0

The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note: the “metric” dimensions are the ruling numbers. To solve the metric pitch BGA dilemma, one should have a basic understanding of the metric feature sizes for: BGA Ball Sizes and BGA Land Pattern Pad Construction BGA Via Anatomy Trace/Space Trace and Via Routi... » read more

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