tag: Boeing

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 26 Jun, 2020 - Comments: 0

Security The U.S. Defense Advanced Research Projects Agency (DARPA) selected Synopsys as the main contractor to provide SoC design tools and security IP for its Automatic Implementation of Secure Silicon (AISS) program. The four-year program’s goal to develop a design tool and IP ecosystem to automate adding security into integrated circuits. Synopsys will be working on a research team with ... » read more

More Multiply-Accumulate Operations Everywhere
By Ed Sperling - 02 Apr, 2020 - Comments: 1

Geoff Tate, CEO of Flex Logix, sat down with Semiconductor Engineering to talk about how to build programmable edge inferencing chips, embedded FPGAs, where the markets are developing for both, and how the picture will change over the next few years. SE: What do you have to think about when you're designing a programmable inferencing chip? Tate: With a traditional FPGA architecture you ha... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Manufacturing Bits: Feb. 25
By Mark LaPedus - 25 Feb, 2020 - Comments: 0

Diamond finFETs HRL Laboratories has made new and significant progress to develop diamond finFETs. HRL, a joint R&D venture between Boeing and General Motors, has developed a new ohmic regrowth technique for diamond FETs. This in turn could pave the way towards commercial diamond FETs. Applications include spacecraft, satellites and systems with extreme temperatures. Still in R&D, diamo... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Feb, 2020 - Comments: 0

Internet of Things SEMI-FlexTech launched six flexible hybrid electronics (FHE) projects, collaborating with U.S. Army Research Laboratory (ARL), to accelerate innovations in sensor and sensor systems. Participating in the projects are American Semiconductor, Inc., University of Texas El Paso, Tekscan, PARC, Alertgy, and Iowa State University, among others. Some of the projects include develop... » read more

Design For Airborne Electronics
By Ann Mutschler - 03 Feb, 2020 - Comments: 0

The Next Generation Air Transportation System (NextGen), an FAA-led modernization of America's air transportation system meant to make flying more efficient, predictable and safer, is currently underway as one of the most ambitious infrastructure projects in U.S. history. This is not just a minor upgrade to an aging infrastructure. The FAA and partners are in the process of implementing new ... » read more

The Week In Review: Semiconductors
By Susan Rambo - 27 Dec, 2019 - Comments: 0

The tech-centric NASDAQ index this week broke 9,000, which was a first. Key to the latest run-up were reports of a breakthrough on the trade war with China and continued low interest rates. Chuck Peddle, who helped democratize computing and fuel Moore's Law with his $25 processor chip, passed away last week. Peddle designed the MOS Technology 6502, which was the basis for the KIM-1 single-bo... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 07 Jun, 2019 - Comments: 0

Products/Services Achronix Semiconductor selected the Rambus GDDR6 PHY for its next-generation Speedster7t line of field-programmable gate arrays. The Rambus GDDR6 PHY is used in advanced driver-assistance systems, artificial intelligence, graphics, machine learning, and networking applications. Arm and Marvell Technology Group will work together on design and development of Marvell’s nex... » read more

Auto Reliability At The System Level
By Ed Sperling - 28 Mar, 2019 - Comments: 0

Carmakers and chipmakers are approaching autonomous vehicle design from very different perspectives, and while they both talk about safety and reliability as the end goals, they have widely divergent ideas about how to get there. All of this is just beginning to come into focus as carmakers vie for leadership in the autonomous vehicle space, and much of it appears to hinge on the definition ... » read more

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