Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

The Chiplet Race Begins

By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Testing Cars In Context

By Ed Sperling - 12 Jul, 2018 - Comments: 0

The choices for companies developing systems or components that will work in autonomous vehicles is to road test them for millions of miles or to simulate them, or some combination of both. Simulation is much quicker, and it has worked well in the semiconductor world for decades. Simulating a chip or electronic system in context is hard enough. But simulating a system of systems in the real... » read more

The Week in Review: IoT

By Jeff Dorsch - 18 May, 2018 - Comments: 0

Conferences Keynote highlights from the Internet of Things World 2018 conference: “Safety is the most important thing,” said Russ Benson, vice president of IT product systems at Boeing; “It’s all about data,” said Juan Perez, chief information officer and chief engineering officer of UPS; “Semiconductors accelerate IoT growth,” said Tony Keirouz, vice president of IoT strategy, e... » read more

Manufacturing Bits: Feb. 6

By Mark LaPedus - 06 Feb, 2018 - Comments: 0

GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs... » read more

Metal Markets In Flux

By Mark LaPedus - 24 Jan, 2018 - Comments: 0

Markets for critical metals are becoming turbulent, creating shortages and widespread supply chain concerns. Critical metals are the raw elements and materials used in the production of aerospace/defense systems, automobiles, batteries, computers and electronic products. Many critical metals also are scarce, and there is high risk associated with their supply. In a recent report, the Europea... » read more

DARPA CHIPS Program Pushes For Chiplets

By Ann Mutschler - 14 Sep, 2017 - Comments: 0

While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

Tech Talk: DO-254

By Ed Sperling - 24 Aug, 2017 - Comments: 0

Aldec's Louie De Luna explains the safety critical standard for the aerospace industry and how that parallels what's happening in automotive electronics. https://youtu.be/qa1g1NNVj60 » read more

Manufacturing Bits: Aug. 1

By Mark LaPedus - 01 Aug, 2017 - Comments: 0

Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

Quality Issues Widen

By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

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