Week In Review: Auto, Security, Pervasive Computing


The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Distributed Batteries Within A Heterogeneous 3D IC To Optimize Performance


A technical paper titled “On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits” was published by researchers at University of Florida and Brookhaven National Laboratory. Abstract: "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consumer electr... » read more

Directed Self-Assembly Finds Its Footing


Ten years ago, when the industry was struggling to deliver EUV lithography, directed self-assembly (DSA) roared to the forefront of research and development for virtually every manufacturer determined to extend the limits of 193i. It was the hot topic at of the 2012 SPIE Advanced Lithography Conference, with one attendee from Applied Materials comparing its potential to disrupt the industry to ... » read more

Chip Industry’s Technical Paper Roundup: July 12


New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 


A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

Chip Industry’s Technical Paper Roundup: May 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Toolbox For Designing Heterogeneous Quantum Systems


A new technical paper titled "Microarchitectures for Heterogeneous Superconducting Quantum Computers" was published by researcher at: Pacific Northwest National Laboratory, Princeton University, University of Chicago, Rutgers University, MIT, Brookhaven National Laboratory, and Infleqtion. Abstract: "Noisy Intermediate-Scale Quantum Computing (NISQ) has dominated headlines in recent years, ... » read more

Research Bits: March 6


2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Synchrotron S-ray Diffraction-based Non-destructive Nanoscale Mapping of Si/SiGe Nanosheets for GAA structures


New research paper titled "Mapping of the mechanical response in Si/SiGe nanosheet device geometries" from researchers at IBM T.J. Watson Research Center and Brookhaven National Laboratory. Sponsored by U.S. DOE. Abstract "The performance of next-generation, nanoelectronic devices relies on a precise understanding of strain within the constituent materials. However, the increased flexibilit... » read more

Week In Review: Design, Low Power


Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

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