tag: Brookhaven National Laboratory

Distributed Batteries Within A Heterogeneous 3D IC To Optimize Performance
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits” was published by researchers at University of Florida and Brookhaven National Laboratory. Abstract: "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consumer electr... » read more

Directed Self-Assembly Finds Its Footing
By Gregory Haley - 17 Aug, 2023 - Comments: 0

Ten years ago, when the industry was struggling to deliver EUV lithography, directed self-assembly (DSA) roared to the forefront of research and development for virtually every manufacturer determined to extend the limits of 193i. It was the hot topic at of the 2012 SPIE Advanced Lithography Conference, with one attendee from Applied Materials comparing its potential to disrupt the industry to ... » read more

Chip Industry’s Technical Paper Roundup: July 12
By Liz Allan - 12 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

Chip Industry’s Technical Paper Roundup: May 16
By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Toolbox For Designing Heterogeneous Quantum Systems
By Technical Paper Link - 08 May, 2023 - Comments: 0

A new technical paper titled "Microarchitectures for Heterogeneous Superconducting Quantum Computers" was published by researcher at: Pacific Northwest National Laboratory, Princeton University, University of Chicago, Rutgers University, MIT, Brookhaven National Laboratory, and Infleqtion. Abstract: "Noisy Intermediate-Scale Quantum Computing (NISQ) has dominated headlines in recent years, ... » read more

Research Bits: March 6
By Jesse Allen - 06 Mar, 2023 - Comments: 0

2D TMDs on silicon Engineers at MIT, University of Texas at Dallas, Institute for Basic Science, Sungkyunkwan University, Washington University in St. Louis, University of California at Riverside, ISAC Research, and Yonsei University found a way to grow 2D materials on industry-standard silicon wafers while preserving their crystalline form. Using a new “nonepitaxial, single-crystalline g... » read more

Synchrotron S-ray Diffraction-based Non-destructive Nanoscale Mapping of Si/SiGe Nanosheets for GAA structures
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Mapping of the mechanical response in Si/SiGe nanosheet device geometries" from researchers at IBM T.J. Watson Research Center and Brookhaven National Laboratory. Sponsored by U.S. DOE. Abstract "The performance of next-generation, nanoelectronic devices relies on a precise understanding of strain within the constituent materials. However, the increased flexibilit... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Research Bits: March 29
By Jesse Allen - 29 Mar, 2022 - Comments: 0

Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

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