tag: Cadence Design Systems

New Design Approaches For Automotive
By Ann Mutschler - 01 Jul, 2021 - Comments: 0

The push toward increasing autonomy in automotive is driving new approaches in electronics development. Instead of designing individual components, the focus now is on modeling in context. The ultimate goal is to create an executable specification based on industry-accepted standards, with enough flexibility to be able to customize that spec for different customers. This is a difficult engin... » read more

IoT Security: Confusing And Fragmented
By Bryon Moyer - 01 Jul, 2021 - Comments: 0

Security regulations for Internet-of-Things (IoT) devices are evolving around the world, but there is no consistent set of requirements that can be applied globally — and there may never be. What exists today is a patchwork of certification labs and logos. That makes it difficult for IoT-device designers to know where to get their security blessed. Unlike in data centers, where there is a ... » read more

Internet of Things (IoT)
By Cadence - 30 Jun, 2021 - Comments: 0

The wide range of internet of things (IoT) applications in development today are made possible by smart devices operating across different network configurations, frequencies, power requirements, and protocols. Developing cost-effective IoT solutions requires a smart, organized approach to radio and antenna integration within a design flow that may have little to do with traditional RF product ... » read more

Data Centers On Wheels
By Ann Mutschler - 28 Jun, 2021 - Comments: 2

Automotive architectures are evolving quickly from domain-based to zonal, leveraging the same kind of high-performance computing now found in data centers to make split-second decisions on the road. This is the third major shift in automotive architectures in the past five years, and it's one that centralizes processing using 7nm and 5nm technology, specialized accelerators, high-speed memor... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Jun, 2021 - Comments: 0

Automotive Cadence will be capturing design insights from Presto Engineering, an ASIC designer working on high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto, which also provides semiconductor services such as test and qualification, will use Cadence’s EDA and analysis tools (Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity Xt... » read more

Rocky Road To Designing Chips In The Cloud
By Ann Mutschler - 24 Jun, 2021 - Comments: 0

EDA is moving to the cloud in fits and starts as tool vendors sort out complex financial models and tradeoffs while recognizing a potentially big new opportunity to provide unlimited processing capacity using a pay-as-you-go approach. By all accounts, a tremendous amount of tire-kicking is happening now as EDA vendors and users delve into the how and why of moving to the cloud for chip desig... » read more

IP Solutions For A Data-Centric World
By Cadence - 23 Jun, 2021 - Comments: 0

We’re in an era of sizeable growth in data and compute demand, along with increasing global data traffic. As a result, high-performance computing, data communications, networking, and storage systems are taking center stage in many application areas, driven by newer applications such as analytics, artificial intelligence (AI), genomics, and simulation-intensive workloads. Power efficiency, hi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Jun, 2021 - Comments: 0

Automotive U.S. electric truck manufacturer Lordstown Motors has an electric truck but after a large buyer fell through, it admitted it does not have any firm orders on its trucks, according to an AP story. The CEO and CFO resigned earlier this week. The electric car company Canoo announced its US manufacturing facility will be in Oklahoma. Cadence revealed its Tensilica FloatingPoint DSP (... » read more

Targeting Redundancy In ICs
By Brian Bailey - 14 Jun, 2021 - Comments: 0

Technology developed for one purpose is often applicable to other areas, but organizational silos can get in the way of capitalizing on it until there is a clear cost advantage. Consider memory. All memories are fabricated with spare rows and columns that are swapped in when a device fails manufacturing test. "This is a common method to increase the yield of a device, based on how much memor... » read more

Thermal Floorplanning For Chips
By Brian Bailey - 10 Jun, 2021 - Comments: 0

Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

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