tag: Cadence

Verification In The Cloud
By Ed Sperling - 29 Jun, 2017 - Comments: 0

By Ed Sperling Leasing of cloud-based verification resources on an as-needed basis is finally beginning to gain traction after more than a decade of false starts and over-optimistic expectations. All of the major EDA vendors now offer cloud-based services. They view this as a way of either supplementing a chipmaker's existing resources at various peak use times, or for small and midsize com... » read more

Hybrid Emulation
By Brian Bailey - 29 Jun, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the growing usage of hybrid verification approaches with Frank Schirrmeister, senior group director of product management & marketing for [getentity id="22032" e_name="Cadence"]; Russ Klein, program director for pre-silicon debug products at [getentity id="22017" e_name="Mentor, a Siemens Business"]; [getperson id="11027" comment="Phil Moorby"],... » read more

Choosing The Right Superlinting Technology For Early RTL Code Signoff
By Cadence - 28 Jun, 2017 - Comments: 0

No one can afford to go through weeks of verification only to discover problems in the register- transfer level (RTL) code that might not be functionally wrong, but do not follow established rules for successful implementation. Traditional lint tools have become ineffective in evaluating RTL code for today’s larger, more complex designs. However, superlinting technology, such as the Cadence J... » read more

Blog Review: June 28
By Jesse Allen - 28 Jun, 2017 - Comments: 0

Mentor's Craig Armenti notes the benefits, and challenges, of investing in modular design in the PCB domain. Cadence's Paul McLellan covers a DAC chat with CEO Lip-Bu Tan on the rise of advanced packaging and investments in AI and autonomous driving. Synopsys' Jim Hartnett examines some of the challenges and tradeoffs involved in building good security practices in hospital environments. ... » read more

Verification And The IoT
By Ed Sperling - 28 Jun, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Safety Plus Security: Solutions And Methodologies
By Ed Sperling - 26 Jun, 2017 - Comments: 0

By Ed Sperling & Brian Bailey As more technology makes its way into safety-critical markets—and as more of those devices are connected to the Internet—security issues are beginning to merge with safety issues. The number of attempted cyberattacks is up on every front, which has big implications for devices used in safety-related applications. There are more viruses, ransomware, an... » read more

The Week In Review: Design
By Jesse Allen - 23 Jun, 2017 - Comments: 0

M&A Silvaco will acquire SoC Solutions, adding more IP experience to the company's portfolio. SoC Solutions, based in Atlanta, GA, focuses on pre-configured IP subsystems and IP targeting low power IoT and machine-to-machine communication. Terms of the deal were not disclosed, but the acquisition is expected to close soon. Imagination is putting the rest of the company up for sale after... » read more

Wednesday At DAC
By Brian Bailey - 22 Jun, 2017 - Comments: 0

Wednesday at DAC started off in usual fashion with a keynote. For the third day, the focus of the talk was the IoT and how significant the change is going to be. Tyson Tuttle, CEO of Silicon Labs, was the speaker. While there are a lot of figures about how many devices will be connected in the future, Tuttle put it into a different perspective. "There will 70B connected devices by 2025 worth $... » read more

Verification Unification
By Brian Bailey - 22 Jun, 2017 - Comments: 0

Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Blog Review: June 21
By Jesse Allen - 21 Jun, 2017 - Comments: 0

Mentor's John McMillan looks into the unique form-factors and components influencing IoT PCB designs. Cadence's Paul McLellan notes some big topics at the Samsung Foundry Forum: FD-SOI, embedded MRAM, and which gate-all-around FET architecture may be the winner. Synopsys' Eric Huang has a lighthearted look at why to buy IP versus building it. Rambus' Aharon Etengoff points to another U... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy