tag: Cadence

Week In Review: Design, Low Power
By Jesse Allen - 25 Mar, 2022 - Comments: 0

Design services firm SemiFive acquired Analog Bits, a provider of low-power mixed-signal IP. Analog Bits' portfolio includes precision clocking macros, I/Os, SerDes, and sensors to monitor PVT. It was founded in 1995 and based in Sunnyvale, California. “Analog Bits has a solid track record of developing and delivering differentiated and high-quality mixed signal IP addressing multiple market ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 25 Mar, 2022 - Comments: 0

Automotive Suzuki will collaborate with SkyDrive on flying cars. SkyDrive is working on an air taxi service that it wants to launch at the 2025 World Exposition in Osaka, Japan. Recalls: The car company Tesla is recalling 947 vehicles in the United States because rearview image lags and does not display immediately when the car is put into reverse, said the National Highway Traffic Safety A... » read more

Incremental Design Breakdown
By Brian Bailey - 24 Mar, 2022 - Comments: 0

For the past two decades, most designs have been incremental in nature. They heavily leveraged IP used in previous designs, and that IP often was developed by third parties. But there are growing problems with that methodology, especially at advanced nodes where back-end issues and the impact of 'shift left' are reducing the savings from reuse. The value of IP reuse has been well established... » read more

Autonomous Design Automation: How Far Are We?
By Frank Schirrmeister - 24 Mar, 2022 - Comments: 0

The year is 2009, during the Design Automation Conference (DAC) at a press dinner in a posh little restaurant in San Francisco’s Civic Center. About two glasses of red wine in, one of the journalists challenges the table: “So, how far away are we from the black box that we feed with our design requirements and it produces the design that we send to the foundry?” We discussed all the indus... » read more

How To Justify A Data Center
By Ann Mutschler - 24 Mar, 2022 - Comments: 0

The breadth of cloud capabilities and improvements in cost and licensing structures is prompting chipmakers to consider offloading at least some of their design work into the cloud. Cloud is a viable business today for semiconductor design. Over the past decade, the interest in moving to cloud computing has grown from an idea that was fun to talk about — but which no one was serious about ... » read more

Planning EDA’s Next Steps
By Ed Sperling - 24 Mar, 2022 - Comments: 0

Anirudh Devgan, Cadence's new CEO, and the recipient of the Phil Kaufman Award in December, sat down with Semiconductor Engineering to talk about what's next in EDA, the underlying technology and business challenges and changes, and new markets that are unfolding for floor-planning, verification, CFD, and advanced packaging. SE: Where does EDA need to improve? Devgan: We have made it much... » read more

Blog Review: March 23
By Jesse Allen - 23 Mar, 2022 - Comments: 0

Arm's Ilias Vougioukas presents new ways to improve on virtual to physical memory translation without breaking any of the pre-existing hardware or software. Siemens' Scot Morrison considers the current regulatory landscape for security of medical devices, including how device manufactures need to proactively implement a plan to find, assess, and respond to potential vulnerabilities. Synop... » read more

CXL and OMI: Competing or Complementary?
By Bryon Moyer - 23 Mar, 2022 - Comments: 1

System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications
By Cadence - 23 Mar, 2022 - Comments: 0

By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

What Else Can You Do While Driving A Car?
By Ann Mutschler - 16 Mar, 2022 - Comments: 0

Increasing levels of autonomy in vehicles are driving increased demands for new technology. Consumers care about the electronics in their vehicles, for both safety and convenience, and those features are impacting both purchase decisions and new vehicle designs. As vehicles grow in sophistication with advanced driver assistance, electrification, or alternative fuel sources, personalized vehi... » read more

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