Startup Funding: Q1 2026


The new year started off with a bang for private semiconductor companies, with 18 garnering mega funding rounds exceeding $100 million, and two, Rapidus and Cerebras, reaching the $1 billion mark. Predictably, the vast majority of those are either designing chips primarily for AI inference workloads or attempting to overcome bandwidth limitations by improving interconnects from the chip level t... » read more

Chip Industry Week In Review


Think tank IAPS' report on AI integrity attacks contends that advanced AI systems must be protected from hidden tampering, backdoors, or unauthorized changes that could alter their behavior or outputs, especially when AI adoption is scaling rapidly, with over 60% of the federal workforce now using AI every day. Geopolitics The U.S. government has drafted new export rules that may give W... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Chip Industry Week In Review


Deals: NVIDIA inked a $20B non-exclusive licensing deal with Groq for its inference technology. The startup's founder, Jonathan Ross, and some other employees will join NVIDIA to assist in scaling and advancing the technology. The non-exclusive licensing deal, versus an outright purchase, is a tool other companies have used to avoid antitrust regulation. Samsung Ventures made a strategic inv... » read more

Chip Industry Week in Review


The U.S. government announced new import tariff actions and deals this week, including: The EU: 15% tariff on most goods including semiconductors. According to the EU's president, the action excludes semiconductor equipment. Copper: 50% tariff on all imports of semi-finished copper products and intensive copper derivative products, effective Aug. 1, but raw input material is excluded. ... » read more

Global IC Fabs And Facilities Report: 2024


The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

Chip Industry Week In Review


Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Precision Patterning Options Emerge For Advanced Packaging


The chip industry is ratcheting up investments in advanced packaging as it strives to keep pace with demands for increased functionality and higher performance, including novel patterning technologies that can reduce costs and speed time to market. Success in advanced packages is partly dependent on effectively managing the interconnectivity between the chips, which requires increasingly pre... » read more

The Race To Glass Substrates


The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve. Glass has been discussed as a replacement material for silicon and organic substrates for more than a decade, primarily in multi-die packages. But ... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

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