Startup Funding: Q1 2026
Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
Advanced Packaging Limits Come Into Focus
Mechanical and process control limits are now shaping what can be manufactured at scale.
All AI Data Center Interconnects Will Be Optical Within 5 Years
InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics, co-packaged optics, optical circuit switch).
The Sub-2nm Paradox
Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.
When Semiconductor Materials Misbehave
The gap between lab performance and fab reality is growing wider as packages grow more complex.
TSMC Tech Symposium 2026, By The Numbers
Foundry rolls out aggressive new roadmap, focusing on area, power, and latency.
Silicon Photonics Lights The Way To More Efficient Data Centers
Optical is the future, but getting there is harder than it looks.
Memory Wall Gets Higher
With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon.
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