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Finding, Predicting EUV Stochastic Defects


Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect detection technology involves various tradeoffs. But it’s imperative to use one or more of them in the fab. Ultimately, these so-called stochastic-induced defects caused by EUV can impact the perf... » read more

AI In Inspection, Metrology, And Test


AI/ML is creeping into multiple processes within the fab and packaging houses, although not necessarily for the purpose it was originally intended. The chip industry is just beginning to learn where AI makes sense and where it doesn't. In general, AI works best as a tool in the hands of someone with deep domain expertise. AI can do certain things well, particularly when it comes to pattern m... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing


The Survey: 2021 Deep Learning Applications List by eBeam Initiative members is a list of current deep learning efforts that are being used in photomask to wafer semiconductor manufacturing. Examples come from ASML, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, Siemens Industries Software, Inc., Siemens EDA, STMicroelectronics, and TASMIT. Published by the eBeam Initiative Membe... » read more

Finding Defects With E-Beam Inspection


Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more